Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | THRB | P10828 | 1/20 | 0.38 |
| ▸ | GGPS1 | O95749 | 6/20 | 0.35 |
| ▸ | SMPD1 | P17405 | 4/20 | 0.35 |
| ▸ | FDPS | P14324 | 9/20 | 0.34 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.33 |
| ▸ | LPAR3 | Q9UBY5 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL206571 | 1.00 | TSHR (0.38) | TSHRTDP1THRBGGPS1SMPD1 | |
| SCHEMBL9106132 | 0.98 | TSHR (0.40) | TSHRTDP1THRBGGPS1SMPD1 | |
| SCHEMBL25436570 | 0.94 | TSHR (0.38) | TSHRTDP1THRBGGPS1SMPD1 | |
| SCHEMBL6414012 | 0.90 | TSHR (0.42) | TSHRTDP1 | |
| SCHEMBL10394008 | 0.86 | TSHR (0.35) | TSHRTHRBGGPS1SMPD1FDPS | |
| Octane SCHEMBL27564992 | 0.84 | TSHR (0.53) | TSHRTDP1THRB | |
| Decane SCHEMBL12471508 | 0.84 | TSHR (0.53) | TSHRTDP1THRB | |
| Dodecane SCHEMBL12471952 | 0.83 | TSHR (0.44) | TSHRTDP1THRBLPAR1LPAR3 | |
| SCHEMBL7629590 | 0.82 | CES2 (0.35) | TSHRTHRBGGPS1SMPD1FDPS | |
| Hexane SCHEMBL3348665 | 0.82 | TSHR (0.57) | TSHRTDP1THRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 256 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173048-B2 | Composition for circuit connection film and circuit connection film using the same | CHEIL INDUSTRIES, INC. (KR) | 2012-05-08 | — | — | US | claimed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | claimed |
| US-12624141-B2 | Composition set containing compound having polyoxyalkylene chain | RESONAC CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-12624140-B2 | Composition containing compound having polyoxyalkylene chain | RESONAC CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-20250346702-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | RESONAC CORP (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250297092-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT | RESONAC CORPORATION (JP) | 2025-09-25 | — | — | US | disclosed |
| WO-2025109868-A1 | THERMOSETTING SILICONE COMPOSITION, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2025-05-30 | — | — | WO | disclosed |
| CN-115551909-B | Thermosetting silicone composition, sheet, and silicone cured product | 信越化学工业株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-119923449-A | Adhesive composition, adhesive film, connection structure, and method for producing same | 株式会社力森诺科 | 2025-05-02 | — | — | CN | disclosed |
| EP-4512837-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | Resonac Corporation (JP) | 2025-02-26 | — | — | EP | disclosed |
| CN-119409905-A | Composition and sheet | 株式会社力森诺科 | 2025-02-11 | — | — | CN | disclosed |
| US-20040214979-A1 | Polyurethanes and polyimides for wires or connectors and a process for connecting wires, curing with curing agents to form films. | FUJINAWA TOHRU | 2004-10-28 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6762249-B1 | RAPID LOW TEMPERATURE SETTING; HIGH ADHESION, STRESS RELEAVING POLYURETHANE RESIN, FREE RADICAL POLYMERIZABLE MATERIAL AND CURING AGENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-07-13 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| EP-1229095-A1 | ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-08-07 | — | — | EP | disclosed |
| EP-1223795-A1 | WIRING-CONNECTING MATERIAL AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12624140-B2 | Composition containing compound having polyoxyalkylene chain | PIEZO1, HVCN1, TAF11 | TSHR 3431/4885TDP1 875/4885THRB 908/4885 |
| US-12624141-B2 | Composition set containing compound having polyoxyalkylene chain | SET, SETD1B, SETDB1 | TSHR 3995/4885TDP1 2220/4885THRB 2256/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.