Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL169372 | 0.95 | THRB (0.36) | THRBSOAT1 | |
| SCHEMBL28823225 | 0.75 | THRB (0.34) | THRBSOAT1 | |
| SCHEMBL194105 | 0.72 | THRB (0.39) | THRB | |
| SCHEMBL29091825 | 0.71 | — | — | |
| SCHEMBL27971876 | 0.71 | — | — | |
| SCHEMBL7053163 | 0.70 | — | — | |
| SCHEMBL852733 | 0.69 | — | — | |
| SCHEMBL9576431 | 0.68 | LMNA (0.42) | SOAT1 | |
| SCHEMBL180402 | 0.66 | HCAR2 (0.31) | SOAT1 | |
| SCHEMBL5515867 | 0.66 | THRB (0.40) | THRBSOAT1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105733154-B | Electrochemical cell | 三星SDI株式会社 | 2020-12-15 | — | — | CN | disclosed |
| US-20150102270-A1 | THERMOSETTING CONDUCTIVE SILICONE COMPOSITION, CONDUCTIVE ADHESIVE COMPRISING THE SAME, CONDUCTIVE DIE BONDING MATERIAL COMPRISING THE SAME, AND PHOTOSEMICONDUCTOR APPARATUS HAVING CURED PRODUCT OF DIE BONDING MATERIAL | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-04-16 | — | — | US | disclosed |
| US-8696942-B2 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-04-15 | — | — | US | disclosed |
| US-8518303-B2 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-27 | — | — | US | disclosed |
| US-20120273974-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2012-11-01 | — | — | US | disclosed |
| US-20120138868-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20120085579-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-04-12 | — | — | US | disclosed |
| EP-2426787-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2012-03-07 | — | — | EP | disclosed |
| EP-2357215-A1 | Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device | Hitachi Chemical Company, Ltd. (JP) | 2011-08-17 | — | — | EP | disclosed |
| EP-2348087-A1 | Adhesive composition, circuit connecting material and connecting structure of circuit member | Hitachi Chemical Company, Ltd. (JP) | 2011-07-27 | — | — | EP | disclosed |
| US-20100159234-A1 | Adhesive film composition for electric and electronic devices and adhesive film using the same | CHEIL INDUSTRIES, INC. (KR) | 2010-06-24 | — | — | US | disclosed |
| US-20100139947-A1 | CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-10 | — | — | US | disclosed |
| US-20100065311-A1 | CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-03-18 | — | — | US | disclosed |
| US-20100025097-A1 | CIRCUIT CONNECTION STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-02-04 | — | — | US | disclosed |
| EP-2148393-A1 | CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2010-01-27 | — | — | EP | disclosed |
| US-20090309220-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-12-17 | — | — | US | disclosed |
| EP-2081222-A1 | CIRCUIT CONNECTION STRUCTURE | Hitachi Chemical Company, Ltd. (JP) | 2009-07-22 | — | — | EP | disclosed |
| EP-2040268-A1 | CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2009-03-25 | — | — | EP | disclosed |
| EP-1967564-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-09-10 | — | — | EP | disclosed |
| EP-1860170-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-11-28 | — | — | EP | disclosed |