Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28823225 | 0.94 | THRB (0.34) | THRB | |
| SCHEMBL5515867 | 0.82 | THRB (0.40) | THRBALDH1A1 | |
| SCHEMBL29031796 | 0.75 | — | — | |
| SCHEMBL169372 | 0.73 | THRB (0.36) | THRB | |
| SCHEMBL9173484 | 0.72 | LMNA (0.42) | ALDH1A1 | |
| SCHEMBL94493 | 0.72 | THRB (0.34) | THRB | |
| SCHEMBL5381374 | 0.71 | ALDH1A1 (0.34) | ALDH1A1 | |
| SCHEMBL5533415 | 0.69 | CA1 (0.31) | — | |
| SCHEMBL4119076 | 0.69 | ALDH1A1 (0.60) | ALDH1A1 | |
| SCHEMBL17501746 | 0.69 | THRB (0.50) | THRBALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12624140-B2 | Composition containing compound having polyoxyalkylene chain | RESONAC CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-12624141-B2 | Composition set containing compound having polyoxyalkylene chain | RESONAC CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-20250346702-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | RESONAC CORP (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250297092-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT | RESONAC CORPORATION (JP) | 2025-09-25 | — | — | US | disclosed |
| CN-119923449-A | Adhesive composition, adhesive film, connection structure, and method for producing same | 株式会社力森诺科 | 2025-05-02 | — | — | CN | disclosed |
| EP-4512837-A1 | COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER | Resonac Corporation (JP) | 2025-02-26 | — | — | EP | disclosed |
| CN-119409905-A | Composition and sheet | 株式会社力森诺科 | 2025-02-11 | — | — | CN | disclosed |
| CN-119403850-A | Composition containing (meth) acrylic polymer and metal particles | 株式会社力森诺科 | 2025-02-07 | — | — | CN | disclosed |
| WO-2025018368-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | 株式会社レゾナック | 2025-01-23 | — | — | WO | disclosed |
| CN-119137173-A | Containing compounds having polyoxyalkylene chains composition of an acrylic copolymer | 株式会社力森诺科 | 2024-12-13 | — | — | CN | disclosed |
| EP-2056406-A1 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF | Hitachi Chemical Company, Ltd. (JP) | 2009-05-06 | — | — | EP | disclosed |
| EP-2046104-A1 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2009-04-08 | — | — | EP | disclosed |
| US-7258918-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20060260744-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| EP-1702968-A1 | CIRCUIT CONNECTION MATERIAL, FILM-SHAPED CIRCUIT CONNECTION MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTION STRUCTURE, AND MANUFACTURING METHOD THEREOF | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2006-09-20 | — | — | EP | disclosed |
| US-20060100314-A1 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-05-11 | — | — | US | disclosed |
| EP-1628363-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-6841628-B2 | Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2005-01-11 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12624140-B2 | Composition containing compound having polyoxyalkylene chain | PIEZO1, HVCN1, TAF11 | THRB 908/4885ALDH1A1 1149/4885 |
| US-12624141-B2 | Composition set containing compound having polyoxyalkylene chain | SET, SETD1B, SETDB1 | THRB 2256/4885ALDH1A1 758/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.