SCHEMBL9469739

SCHEMBL9469739

CCCCCc1c(C#N)c(C#N)cc2ccccc12

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.42
HPGD P15428 4/20 0.38
KDM4E B2RXH2 3/20 0.38
NPSR1 Q6W5P4 2/20 0.38
CLK1 P49759 1/20 0.38
DYRK1A Q13627 1/20 0.38
TLR8 Q9NR97 5/20 0.37
SMN1; SMN2 Q16637 2/20 0.37
HTT P42858 1/20 0.37
RAB9A P51151 1/20 0.37
KMT2A Q03164 1/20 0.37
ALDH1A1 P00352 3/20 0.36
GAA P10253 2/20 0.36
HSD17B10 Q99714 2/20 0.36
GLA P06280 1/20 0.36
POLB P06746 1/20 0.36
CASP1 P29466 1/20 0.36
CASP7 P55210 1/20 0.36
SAE1 Q9UBE0 1/20 0.36
UBA2 Q9UBT2 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29144799 0.96 HPGD (0.40) MAPTHPGDKDM4ENPSR1CLK1
SCHEMBL27779196 0.89 MAPT (0.42) MAPTHPGDKDM4ENPSR1CLK1
SCHEMBL28981972 0.81 NCEH1 (0.43) MAPTHPGDKDM4ENPSR1TLR8
SCHEMBL10880958 0.80 MAPT (0.51) MAPTHPGDKDM4ENPSR1SMN1; SMN2
SCHEMBL299862 0.78 MAPT (0.53) MAPTHPGDKDM4ETLR8ALDH1A1
SCHEMBL6646801 0.77 CLK1 (0.42) MAPTKDM4ECLK1DYRK1AKMT2A
SCHEMBL9803760 0.77 NCOA3 (0.37) MAPTHPGDKDM4ECLK1DYRK1A
SCHEMBL27808798 0.77 LIPG (0.38) MAPTHPGDKDM4ETLR8HTT
SCHEMBL28171463 0.77 TLR8 (0.46) MAPTHPGDKDM4ETLR8ALDH1A1
SCHEMBL16267023 0.76 MAPT (0.55) MAPTHPGDKDM4ETLR8ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108431133-B Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board 三菱瓦斯化学株式会社 2019-06-14 CN disclosed
CN-109415491-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2019-03-01 CN disclosed
CN-109071772-A Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board 三菱瓦斯化学株式会社 2018-12-21 CN disclosed
CN-107001767-B Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board 三菱瓦斯化学株式会社 2018-11-02 CN disclosed
CN-107207855-B Resin composition for printed circuit board, prepreg, resin compounded piece and clad with metal foil plywood 三菱瓦斯化学株式会社 2018-09-11 CN disclosed
CN-108431133-A Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board 三菱瓦斯化学株式会社 2018-08-21 CN disclosed
CN-107207834-B Resin composition for printed circuit board, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) 三菱瓦斯化学株式会社 2018-05-29 CN disclosed
CN-107531881-A Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2018-01-02 CN disclosed
CN-107531882-A Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) 三菱瓦斯化学株式会社 2018-01-02 CN disclosed
CN-107406582-A Cyanate ester compound, curable resin composition containing the same, and cured product thereof 三菱瓦斯化学株式会社 2017-11-28 CN disclosed
CN-104755422-B Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition 三菱瓦斯化学株式会社 2016-11-09 CN disclosed
CN-104755422-A Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition MITSUBISHI GAS CHEMICAL CO 2015-07-01 CN disclosed
CN-100393834-C Adhesive compositions containing organic spacers and methods for use thereof HENKEL LOCTITE CORP (US) 2008-06-11 CN disclosed
CN-1643095-A Adhesive compositions containing organic spacers and methods of use thereof HENKEL LOCTITE CORP (US) 2005-07-20 CN disclosed
CN-1178287-C Reprocessable thermosetting resin compositions ��˶����̩�ع�˾ 2004-12-01 CN disclosed
CN-1384975-A Reprocessable thermosetting resin compositions LOCTITE CORP (US) 2002-12-11 CN disclosed
US-RE34480-E Naphthalocyanine compounds YAMAMOTO KAGAKU GOSEI CO., LTD. (JP) 1993-12-14 US disclosed
EP-0134518-B1 NAPHTHALOCYANINE COMPOUNDS Yamamoto Chemicals, Inc. (JP) 1988-07-06 EP disclosed
US-4622179-A INFRARED RAYS ABSORBERS YAMAMOTO KAGAKU GOSEI CO., LTD. (JP) 1986-11-11 US disclosed
EP-0134518-A1 Naphthalocyanine compounds Yamamoto Chemicals, Inc. (JP) 1985-03-20 EP disclosed