SCHEMBL27808798

SCHEMBL27808798

CCCCCc1cc(C#N)c(C#N)c2ccccc12

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LIPG Q9Y5X9 1/20 0.38
ANPEP P15144 1/20 0.36
TLR8 Q9NR97 1/20 0.36
HSD17B10 Q99714 3/20 0.36
TSHR P16473 3/20 0.36
MAPT P10636 6/20 0.35
KDM4E B2RXH2 3/20 0.35
ALDH1A1 P00352 3/20 0.35
GAA P10253 3/20 0.35
GLA P06280 2/20 0.35
HPGD P15428 2/20 0.35
CASP1 P29466 2/20 0.35
CASP7 P55210 2/20 0.35
POLB P06746 1/20 0.35
SAE1 Q9UBE0 1/20 0.35
UBA2 Q9UBT2 1/20 0.35
CTSV O60911 1/20 0.35
CTSL P07711 1/20 0.35
CYP3A4 P08684 2/20 0.34
USP2 O75604 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27758163 0.88 ANPEP (0.45) LIPGANPEPTLR8HSD17B10TSHR
SCHEMBL28783637 0.84 LIPG (0.37) LIPGTLR8HSD17B10TSHRMAPT
SCHEMBL11748256 0.83 ANPEP (0.46) ANPEPTLR8TSHRMAPTKDM4E
SCHEMBL27833707 0.78 ANPEP (0.41) LIPGANPEPHSD17B10TSHRMAPT
SCHEMBL9469739 0.77 MAPT (0.42) ANPEPTLR8HSD17B10MAPTKDM4E
SCHEMBL28171463 0.76 TLR8 (0.46) LIPGTLR8HSD17B10TSHRMAPT
SCHEMBL28981977 0.75 ALOX5 (0.44) TSHRMAPTPOLBALOX5HTT
SCHEMBL978626 0.75 LIPG (0.50) LIPGHSD17B10TSHRALDH1A1HPGD
SCHEMBL23093946 0.75 ALDH1A1 (0.43) TSHRMAPTALDH1A1GAAHPGD
SCHEMBL9602680 0.75 MAPT (0.46) LIPGTLR8HSD17B10TSHRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103339206-A Resin composition and semiconductor device SUMITOMO BAKELITE CO 2013-10-02 CN disclosed
CN-102040803-A Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device SUMITOMO BAKELITE CO 2011-05-04 CN disclosed
CN-101778919-A Adhesive composition for semiconductor and semiconductor device manufactured using the same SUMITOMO BAKELITE CO 2010-07-14 CN disclosed