SCHEMBL9491965

SCHEMBL9491965

CC(C)(C)c1ccc(O)c(C(=O)NNC(=O)c2cc(C(C)(C)C)ccc2O)c1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLG P00747 2/20 0.58
KLK1 P06870 2/20 0.58
KLK6 Q92876 2/20 0.58
KLKB1 P03952 1/20 0.58
HSP90AA1 P07900 1/20 0.57
HSP90AB1 P08238 1/20 0.57
ALDH1A1 P00352 2/20 0.53
HSD17B10 Q99714 2/20 0.53
HPGD P15428 1/20 0.53
ALOX15 P16050 1/20 0.53
TDP1 Q9NUW8 1/20 0.53
P2RX1 P51575 1/20 0.51
MAPT P10636 3/20 0.48
MEN1 O00255 3/20 0.48
KMT2A Q03164 3/20 0.48
GAA P10253 1/20 0.48
PKM P14618 1/20 0.48
RECQL P46063 1/20 0.48
POLB P06746 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11691278 0.86 PLG (0.63) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL11329613 0.82 GAA (0.52) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL9493126 0.82 SHBG (0.51) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL6858460 0.81 HSP90AA1 (0.60) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL134234 0.81 HSP90AA1 (0.60) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL20968011 0.81 HSP90AA1 (0.60) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL6581882 0.81 HSP90AA1 (0.60) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL18614004 0.80 HSP90AA1 (0.56) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL648753 0.80 CA12 (0.62) PLGKLK1KLK6KLKB1HSP90AA1
SCHEMBL29637890 0.80 CA12 (0.62) PLGKLK1KLK6KLKB1HSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0300453-B1 COPPER-TYPE CONDUCTIVE COATING COMPOSITION MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1993-03-03 EP disclosed
US-4921623-A COPPER POWDER, SALICYCLIC ACID DERIVATIVE, STABILITY MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-05-01 US disclosed
EP-0300453-A2 Copper-type conductive coating composition MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1989-01-25 EP disclosed
US-4306930-A INCORPORATING A HYDRAZIDE OR DIHYDRAZIDE AND THEN VULCANIZING IN CONTACT WITH A METAL CIBA-GEIGY CORPORATION (US) 1981-12-22 US disclosed
US-4077948-A N-SALICYLIDENE-N*-SALICYLHYDRAZIDES CIBA-GEIGY CORPORATION (US) 1978-03-07 US disclosed
US-3994987-A Metal deactivators as adhesion promotors for vulcanizable elastomers to metals CIBA-GEIGY CORPORATION (US) 1976-11-30 US disclosed