SCHEMBL9514883

SCHEMBL9514883

O=C1C=CC(=O)N1c1cccc(Oc2ccc(-c3ccccc3)cc2)c1

nearest known ligand 0.68

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.68
FAAH O00519 5/20 0.68
HSP90AA1 P07900 3/20 0.68
ALDH1A1 P00352 1/20 0.68
PKM P14618 1/20 0.68
HTT P42858 1/20 0.68
ATM Q13315 1/20 0.68
GSTP1 P09211 1/20 0.49
FFAR1 O14842 1/20 0.45
FFAR4 Q5NUL3 1/20 0.45
MAOA P21397 1/20 0.44
MAOB P27338 1/20 0.44
AKR1C3 P42330 1/20 0.44
HPN P05981 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL331306 0.95 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30793027 0.95 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL4263923 0.92 MGLL (0.73) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL27863609 0.90 MGLL (0.71) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL27863634 0.90 MGLL (0.71) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29754402 0.90 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL487151 0.90 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29391228 0.90 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL9491223 0.90 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL2120468 0.87 MGLL (0.77) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0359500-B1 Resin compositions for sealing semiconductors MITSUI TOATSU CHEMICALS (JP) 1993-12-08 EP disclosed
US-5082880-A Shock and heat resistant MITSUI TOATSU CHEMICALS, INC. (JP) 1992-01-21 US disclosed
EP-0359500-A2 Resin compositions for sealing semiconductors MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-03-21 EP disclosed