Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.64 |
| ▸ | FAAH | O00519 | 6/20 | 0.60 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.59 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.59 |
| ▸ | PKM | P14618 | 2/20 | 0.59 |
| ▸ | HTT | P42858 | 2/20 | 0.59 |
| ▸ | ATM | Q13315 | 2/20 | 0.59 |
| ▸ | HPN | P05981 | 1/20 | 0.46 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | CCR6 | P51684 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30793027 | 1.00 | MGLL (0.64) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL9514883 | 0.95 | MGLL (0.68) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL487151 | 0.95 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL9491223 | 0.95 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29391228 | 0.95 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29754402 | 0.95 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL2120468 | 0.91 | MGLL (0.77) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL2120164 | 0.91 | MGLL (0.72) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL24119952 | 0.90 | MGLL (0.74) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL4263923 | 0.89 | MGLL (0.73) | MGLLFAAHHSP90AA1ALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0451405-B1 | Thermosetting resin composition | MITSUI TOATSU CHEMICALS (JP) | 1994-12-14 | — | — | EP | claimed |
| EP-0372775-B1 | Thermosetting-resin-forming compositions | MITSUI TOATSU CHEMICALS (JP) | 1994-05-18 | — | — | EP | claimed |
| EP-0359500-B1 | Resin compositions for sealing semiconductors | MITSUI TOATSU CHEMICALS (JP) | 1993-12-08 | — | — | EP | claimed |
| EP-0342912-B1 | THERMOSETTING RESIN COMPOSITIONS | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-05-12 | — | — | EP | claimed |
| US-5104962-A | Also containing bismaleimide groups; toughness, heat resistance | MITSUI TOATSU CHEMICALS, INC. (JP) | 1992-04-14 | — | — | US | claimed |
| US-5082880-A | Shock and heat resistant | MITSUI TOATSU CHEMICALS, INC. (JP) | 1992-01-21 | — | — | US | claimed |
| EP-0451405-A1 | Thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-10-16 | — | — | EP | claimed |
| US-5015674-A | Polysiloxanes for sealing semiconductors, modified with acrylates | MITSUI TOATSU CHEMICALS, INC. (JP) | 1991-05-14 | — | — | US | claimed |
| US-4987207-A | Toughness, flexibility, adhesion, heat resistance | MITSUI TOATSU CHEMICALS, INC. (JP) | 1991-01-22 | — | — | US | claimed |
| US-4968762-A | IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-11-06 | — | — | US | claimed |
| EP-0372775-A1 | Thermosetting-resin-forming compositions | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-06-13 | — | — | EP | claimed |
| EP-0359500-A2 | Resin compositions for sealing semiconductors | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-03-21 | — | — | EP | claimed |
| EP-0354033-A2 | Resin compositions for sealing semiconductors | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-02-07 | — | — | EP | claimed |
| EP-0342912-A1 | Thermosetting resin compositions | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1989-11-23 | — | — | EP | claimed |
| US-12168709-B2 | Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module | RESONAC CORPORATION (JP) | 2024-12-17 | — | — | US | disclosed |
| WO-2024185371-A1 | RESIN COMPOSITION, AND INTER-LAYER INSULATING ADHESIVE FILM, LAMINATED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE USING SAME | ナミックス株式会社 | 2024-09-12 | — | — | WO | disclosed |
| EP-3405010-B1 | MULTILAYER TRANSMISSION LINE PLATE | RESONAC CORP (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-4831102-A | Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1989-05-16 | — | — | US | disclosed |
| EP-0294931-A1 | Self-lubricating thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-14 | — | — | EP | disclosed |
| EP-0294930-A1 | Thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-14 | — | — | EP | disclosed |