SCHEMBL9550343

SCHEMBL9550343

COC(=O)C1(C(=O)OC)CCC(O)CC1

nearest known ligand 0.38

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.38
MAPT P10636 1/20 0.36
LMNA P02545 1/20 0.33
EPHX2 P34913 1/20 0.33
CYP4F2 P78329 1/20 0.32
CYP4A11 Q02928 1/20 0.32
MEN1 O00255 1/20 0.31
POLB P06746 1/20 0.31
KMT2A Q03164 1/20 0.31
ALDH1A1 P00352 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25642139 0.87 CHRM2 (0.37) NPSR1MAPT
SCHEMBL25644757 0.83 RAB9A (0.33) EPHX2POLBALDH1A1
SCHEMBL4870839 0.82 NPSR1 (0.38) NPSR1MAPTLMNACYP4F2CYP4A11
SCHEMBL7450684 0.80 NPSR1 (0.36) NPSR1MAPTLMNAEPHX2CYP4F2
SCHEMBL9041790 0.80 FFAR3 (0.37) NPSR1MAPTLMNAEPHX2CYP4F2
SCHEMBL15115826 0.80 FFAR3 (0.37) NPSR1MAPTLMNAEPHX2CYP4F2
SCHEMBL14128933 0.80 EPHX2 (0.37) NPSR1MAPTLMNAEPHX2CYP4F2
SCHEMBL3883900 0.80 FFAR3 (0.37) NPSR1MAPTLMNAEPHX2CYP4F2
SCHEMBL12462298 0.80 NPSR1 (0.46) NPSR1MAPTLMNACYP4F2CYP4A11
SCHEMBL225044 0.80 NPSR1 (0.46) NPSR1MAPTLMNACYP4F2CYP4A11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5216173-A Curing agents for epoxy resins; polyimides HENKEL RESEARCH CORPORATION (US) 1993-06-01 US disclosed
EP-0484381-A1 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1992-05-13 EP disclosed
WO-1991001307-A2 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1991-02-07 WO disclosed