Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 2/20 | 0.43 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2301850 | 0.87 | GAA (0.48) | GAATSHRALDH1A1TDP1LMNA | |
| SCHEMBL4435639 | 0.82 | GAA (0.45) | GAAALDH1A1LMNAHSD17B10 | |
| SCHEMBL5476603 | 0.81 | TSHR (0.37) | TSHRALDH1A1TDP1 | |
| SCHEMBL7674315 | 0.79 | GAA (0.41) | GAAALDH1A1 | |
| SCHEMBL28919443 | 0.79 | TSHR (0.36) | TSHRALDH1A1TDP1 | |
| SCHEMBL9493223 | 0.79 | ALOX15 (0.37) | TSHRALDH1A1TDP1LMNAHSD17B10 | |
| SCHEMBL1742403 | 0.77 | GAA (0.40) | GAATSHRALDH1A1LMNAHSD17B10 | |
| Bicarbonate SCHEMBL28698543 | 0.77 | TSHR (0.42) | TSHRALDH1A1TDP1 | |
| SCHEMBL4451379 | 0.76 | ALDH1A1 (0.44) | GAATSHRALDH1A1LMNAHSD17B10 | |
| SCHEMBL701581 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115551915-B | Alkali-soluble resin containing polymerizable unsaturated group, process for producing the same, photosensitive resin composition, and cured product thereof | 日铁化学材料株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-119846903-A | Preparation method and application of undercut-free high-refractive-index negative OC photoresist and photo-curing pattern | 西安思摩威新材料有限公司 | 2025-04-18 | — | — | CN | disclosed |
| CN-119842006-A | Resin with thermal crosslinking structure and preparation method thereof, optical adhesive composition, microlens and preparation method thereof | 西安思摩威新材料有限公司 | 2025-04-18 | — | — | CN | disclosed |
| CN-119529732-A | Composition for forming adhesive layer, laminate, method for producing laminate, and method for treating laminate | 日铁化学材料株式会社 | 2025-02-28 | — | — | CN | disclosed |
| CN-119193074-A | Composition for forming adhesive layer, laminate, method for producing laminate, and method for treating laminate | 日铁化学材料株式会社 | 2024-12-27 | — | — | CN | disclosed |
| CN-119192537-A | Unsaturated group-containing polymerizable resin, curable resin composition, resin cured film, semiconductor package, and display device | 日铁化学材料株式会社 | 2024-12-27 | — | — | CN | disclosed |
| CN-119126490-A | Preparation method and application of low-residual-stress high-refractive-index negative OC photoresist and photo-curing pattern | 西安思摩威新材料有限公司 | 2024-12-13 | — | — | CN | disclosed |
| CN-112538157-B | Epoxy acrylate resin, alkali-soluble resin, process for producing the same, curable photosensitive resin composition, and cured product thereof | 日铁化学材料株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118732390-A | Photosensitive resin composition, cured film, substrate with cured film, and method for producing substrate with cured film | 日铁化学材料株式会社 | 2024-10-01 | — | — | CN | disclosed |
| CN-118530443-A | Unsaturated group-containing polymerizable resin, curable resin composition, laminate, and method for producing and treating laminate | 日铁化学材料株式会社 | 2024-08-23 | — | — | CN | disclosed |
| CN-106959577-B | Photosensitive resin composition, light-shielding film, liquid crystal display device, and methods for producing these | 日铁化学材料株式会社 | 2021-11-05 | — | — | CN | disclosed |
| CN-113448168-A | Photosensitive resin composition, cured film, substrate, method for producing substrate, and display device | 日铁化学材料株式会社 | 2021-09-28 | — | — | CN | disclosed |
| CN-106681104-B | Photosensitive resin composition and method for producing same, light shielding film and method for producing same, and liquid crystal display device and method for producing same | 日铁化学材料株式会社 | 2021-06-15 | — | — | CN | disclosed |
| CN-112538157-A | Epoxy acrylate resin, alkali-soluble resin and method for producing the same, curable and photosensitive resin composition and cured product thereof | 日铁化学材料株式会社 | 2021-03-23 | — | — | CN | disclosed |
| CN-111812942-A | Photosensitive resin composition, cured film and display device | 日铁化学材料株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-111752094-A | Substrate with cured film, method for producing same, resin composition, cured film obtained by curing resin composition, and display device | 日铁化学材料株式会社 | 2020-10-09 | — | — | CN | disclosed |
| CN-111752102-A | Photosensitive resin composition, cured film, substrate with cured film, and method for producing substrate with cured film | 日铁化学材料株式会社 | 2020-10-09 | — | — | CN | disclosed |
| CN-111752101-A | Photosensitive resin composition, cured film, substrate with cured film, and method for producing substrate with cured film | 日铁化学材料株式会社 | 2020-10-09 | — | — | CN | disclosed |
| WO-2019188897-A1 | PRODUCTION METHOD FOR POLYMERIZABLE-UNSATURATED-GROUP-CONTAINING ALKALI-SOLUBLE RESIN, POLYMERIZABLE-UNSATURATED-GROUP-CONTAINING ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING POLYMERIZABLE-UNSATURATED-GROUP-CONTAINING ALKALI-SOLUBLE RESIN AS ESSENTIAL INGREDIENT, AND CURED FILM OF PHOTOSENSITIVE RESIN COMPOSITION INCLUDING POLYMERIZABLE-UNSATURATED-GROUP-CONTAINING ALKALI-SOLUBLE RESIN AS ESSENTIAL INGREDIENT | 日鉄ケミカル＆マテリアル株式会社 | 2019-10-03 | — | — | WO | disclosed |
| US-5128234-A | PRODUCTION OF PHOTOPOLYMERIC FLEXOGRAPHIC RELIEF PRINTING PLATES | BASF AKTIENGESELLSCHAFT (DE) | 1992-07-07 | — | — | US | disclosed |