SCHEMBL968846

SCHEMBL968846

C[Al+2].[H-].[H-]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28893839 0.89
SCHEMBL30943559 0.76
Iodide SCHEMBL1686563 0.75
Fluoride Ion SCHEMBL150863 0.75
Bromide SCHEMBL42156 0.75
Water SCHEMBL10375906 0.75
Hydrochloric Acid SCHEMBL154308 0.75
SCHEMBL3867733 0.75
SCHEMBL311348 0.75
SCHEMBL154041 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 383 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12600816-B2 Alkylene oxide polymerization using aluminum compounds and phosphorus-nitrogen bases DOW GLOBAL TECHNOLOGIES LLC (US) 2026-04-14 US claimed
CN-115119510-B Polymerization of alkylene oxides using aluminum compounds and phosphorus-nitrogen bases 陶氏环球技术有限责任公司 2025-03-14 CN claimed
EP-4097168-B1 ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND CYCLIC AMIDINES DOW GLOBAL TECHNOLOGIES LLC (US) 2023-10-25 EP claimed
CN-116099497-A Composite lithium adsorbent and preparation method thereof 中国科学院过程工程研究所 2023-05-12 CN claimed
US-20230095201-A1 ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND CYCLIC AMIDINES DOW GLOBAL TECHNOLOGIES LLC 2023-03-30 US claimed
US-20230092304-A1 ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND PHOSPHORUS-NITROGEN BASES DOW GLOBAL TECHNOLOGIES LLC 2023-03-23 US claimed
EP-4097169-A1 ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND PHOSPHORUS-NITROGEN BASES Dow Global Technologies LLC (US) 2022-12-07 EP claimed
EP-4097168-A1 ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND CYCLIC AMIDINES Dow Global Technologies LLC (US) 2022-12-07 EP claimed
CN-115119510-A Alkylene oxide polymerization using aluminum compounds and phosphorus-nitrogen bases 陶氏环球技术有限责任公司 2022-09-27 CN claimed
CN-115003730-A Alkylene oxide polymerization using aluminum compounds and cyclic amidines 陶氏环球技术有限责任公司 2022-09-02 CN claimed
US-5180687-A Electroconductive CANON KABUSHIKI KAISHA (JP) 1993-01-19 US claimed
US-5179042-A Vapor deposition CANON KABUSHIKI KAISHA (JP) 1993-01-12 US claimed
US-5154949-A Additive-containing; good surface morphology; transistors; semiconductors CANON KABUSHIKI KAISHA (JP) 1992-10-13 US claimed
EP-0493002-A1 Process for forming deposition film Tsubouchi, Kazuo (JP) 1992-07-01 EP claimed
EP-0466320-A2 Process for preparing a semiconductor device including the selective deposition of a metal CANON KABUSHIKI KAISHA (JP) 1992-01-15 EP claimed
EP-0425084-A1 Process for forming deposited film by use of alkyl aluminum hydride CANON KABUSHIKI KAISHA (JP) 1991-05-02 EP claimed
EP-0420594-A2 Process for forming metal deposited film containing aluminium as main component by use of alkyl aluminium hydride CANON KABUSHIKI KAISHA (JP) 1991-04-03 EP claimed
EP-0420595-A2 Deposited film formation method utilizing selective deposition by use of alkyl aluminum hydride CANON KABUSHIKI KAISHA (JP) 1991-04-03 EP claimed
EP-0420597-A2 Process for forming a deposited film by use of alkyl aluminum hydride and process for preparing semiconductor device CANON KABUSHIKI KAISHA (JP) 1991-04-03 EP claimed
EP-0417997-A1 Process for forming metal deposited film containing aluminum as main component by use of alkyl aluminum hydride CANON KABUSHIKI KAISHA (JP) 1991-03-20 EP claimed