SCHEMBL9718010

SCHEMBL9718010

C=Cc1cc(C)cc(C)c1Cl

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAPGEF4 Q8WZA2 11/20 0.39
KMT2A Q03164 2/20 0.36
LMNA P02545 1/20 0.36
CYP3A4 P08684 1/20 0.36
CHRM1 P11229 1/20 0.36
ALOX15 P16050 1/20 0.36
MAOA P21397 1/20 0.36
TBXA2R P21731 1/20 0.36
ADRA1A P35348 1/20 0.36
HTR2B P41595 1/20 0.36
ALDH1A1 P00352 3/20 0.34
KDM4E B2RXH2 1/20 0.34
MEN1 O00255 1/20 0.34
MAPT P10636 1/20 0.34
MPI P34949 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
ERN1 O75460 1/20 0.32
FFAR4 Q5NUL3 1/20 0.32
TP53 P04637 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30322297 0.77 ALDH1A1 (0.36) CYP3A4CHRM1ALOX15MAOATBXA2R
SCHEMBL29952878 0.77 ERN1 (0.52) RAPGEF4KMT2ALMNACYP3A4CHRM1
SCHEMBL1611521 0.76 ESR1 (0.35) RAPGEF4KMT2ALMNAALDH1A1KDM4E
SCHEMBL18849429 0.74 RAPGEF4 (0.33) RAPGEF4KMT2ASMN1; SMN2ERN1TP53
SCHEMBL234943 0.74 CYP3A4 (0.58) RAPGEF4CYP3A4CHRM1ALOX15MAOA
SCHEMBL10289692 0.73 RAPGEF4 (0.35) RAPGEF4ERN1TP53TDP1
SCHEMBL22579527 0.73 ALDH1A1 (0.38) KMT2ALMNAALDH1A1MEN1MAPT
SCHEMBL9717980 0.73 CYP3A4 (0.36) CYP3A4CHRM1ALOX15MAOATBXA2R
SCHEMBL28510556 0.73 ALDH1A1 (0.33) CYP3A4CHRM1ALOX15MAOATBXA2R
SCHEMBL8259227 0.73 ALDH1A1 (0.46) KMT2ALMNACYP3A4ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
EP-0348906-A1 Heat-resistant resin composition SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-01-03 EP disclosed