⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10170997 | 0.89 | — | — | |
| SCHEMBL10183363 | 0.87 | — | — | |
| SCHEMBL2681162 | 0.87 | — | — | |
| SCHEMBL18898221 | 0.85 | — | — | |
| SCHEMBL3414825 | 0.85 | — | — | |
| SCHEMBL12263837 | 0.85 | — | — | |
| SCHEMBL800554 | 0.84 | — | — | |
| SCHEMBL12221441 | 0.83 | — | — | |
| SCHEMBL800008 | 0.82 | MMP8 (0.32) | — | |
| SCHEMBL9924516 | 0.82 | PRKCA (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 508 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12032290-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2024-07-09 | — | — | US | disclosed |
| US-11914300-B2 | Manufacturing method of semiconductor chip, and kit | FUJIFILM CORPORATION (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20240027908-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20230400769-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| US-20230400767-A1 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMER, AND COMPOUND | JSR CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| US-11835860-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-12-05 | — | — | US | disclosed |
| US-20230384674-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-11-30 | — | — | US | disclosed |
| US-20230375925-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN | FUJIFILM CORPORATION (JP) | 2023-11-23 | — | — | US | disclosed |
| US-20230367210-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-11-16 | — | — | US | disclosed |
| US-20230367212-A1 | PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-11-16 | — | — | US | disclosed |
| US-20100239984-A1 | PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-09-23 | — | — | US | disclosed |
| US-20100168337-A1 | GRADED TOPCOAT MATERIALS FOR IMMERSION LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-07-01 | — | — | US | disclosed |
| US-7678537-B2 | Graded topcoat materials for immersion lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-03-16 | — | — | US | disclosed |
| US-20100015554-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2010-01-21 | — | — | US | disclosed |
| US-20090155715-A1 | PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-18 | — | — | US | disclosed |
| US-20090155718-A1 | PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-18 | — | — | US | disclosed |
| US-7544750-B2 | Top antireflective coating composition with low refractive index at 193nm radiation wavelength | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-09 | — | — | US | disclosed |
| US-20080311530-A1 | GRADED TOPCOAT MATERIALS FOR IMMERSION LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2008-12-18 | — | — | US | disclosed |
| US-20080311506-A1 | GRADED TOPCOAT MATERIALS FOR IMMERSION LITHOGRAPHY | ALLEN ROBERT D | 2008-12-18 | — | — | US | disclosed |
| US-20070087285-A1 | Top antireflective coating composition with low refractive index at 193nm radiation wavelength | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-04-19 | — | — | US | disclosed |