Benzene

Benzene

SCHEMBL977596

C=C(CCC)C(=O)OO.c1ccccc1

nearest known ligand 0.39

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC3 O15379 3/20 0.39
HDAC1 Q13547 3/20 0.39
HDAC2 Q92769 3/20 0.39
HDAC8 Q9BY41 3/20 0.39
FFAR3 O14843 2/20 0.39
ALOX5 P09917 1/20 0.36
ALDH1A1 P00352 4/20 0.36
CES2 O00748 2/20 0.35
CES1 P23141 2/20 0.35
HDAC6 Q9UBN7 1/20 0.34
MAPT P10636 2/20 0.34
HPGD P15428 2/20 0.34
L3MBTL1 Q9Y468 2/20 0.33
CYP2C19 P33261 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
RECQL P46063 2/20 0.33
CTSD P07339 1/20 0.33
CYP3A4 P08684 1/20 0.33
TP53 P04637 1/20 0.32
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL61201 0.93
Ethylene SCHEMBL9715783 0.91 ALDH1A1 (0.39) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL5709260 0.87 ALDH1A1 (0.41) HDAC3HDAC1HDAC2HDAC8FFAR3
Phosphoric Acid SCHEMBL15156826 0.85 ALDH1A1 (0.34) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL7028156 0.85 CES1 (0.41) HDAC3HDAC1HDAC2HDAC8ALDH1A1
SCHEMBL3275801 0.82 KMT2A (0.38) ALOX5ALDH1A1CES2CES1MAPT
SCHEMBL198129 0.80 CES1 (0.44) ALDH1A1CES2CES1TP53TSHR
Butane SCHEMBL5159901 0.78 ALOX15 (0.39) HDAC3HDAC1HDAC2HDAC8FFAR3
Hydrochloric Acid SCHEMBL16599967 0.78 CES1 (0.42) ALDH1A1CES2CES1TP53TSHR
SCHEMBL891395 0.78 CES2 (0.46) ALDH1A1CES2CES1TSHRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8212345-B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure SHIN-ETSU POLYMER CO., LTD. (JP) 2012-07-03 US disclosed
US-20110281509-A1 HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE LINTEC CORPORATION (JP) 2011-11-17 US disclosed
US-7875501-B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure SHIN-ETSU POLYMER CO., LTD. (JP) 2011-01-25 US disclosed
US-20090081852-A1 HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE SHIN-ETSU POLYMER CO., LTD. (JP) 2009-03-26 US disclosed