SCHEMBL978930

SCHEMBL978930

C=CCOc1cccc(O)c1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 4/20 0.50
HSD17B10 Q99714 3/20 0.50
MAPK1 P28482 2/20 0.50
TSHR P16473 1/20 0.50
LIG1 P18858 1/20 0.47
LMNA P02545 4/20 0.47
MAPT P10636 4/20 0.47
ALDH1A1 P00352 4/20 0.47
CYP3A4 P08684 2/20 0.47
ALOX15 P16050 2/20 0.47
KDM4E B2RXH2 2/20 0.47
TP53 P04637 1/20 0.47
ALOX12 P18054 1/20 0.47
JAK2 O60674 1/20 0.45
GAA P10253 1/20 0.45
CYP2A6 P11509 1/20 0.45
ADRA2A P08913 1/20 0.44
ADRA2B P18089 1/20 0.44
ADRA2C P18825 1/20 0.44
ADAMTS4 O75173 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
1-Hydroxy-2-Allyloxybenzene SCHEMBL1562951 0.88 GAA (0.59) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL7072808 0.85 HPGD (0.47) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL4865834 0.83 HPGD (0.46) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL15814879 0.83 CYP3A4 (0.49) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL4942203 0.83 ALDH1A1 (0.50) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL20537007 0.82 HPGD (0.49) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL4192226 0.82 HPGD (0.45) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL5042380 0.80 ERN1 (0.57) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL28538424 0.79 MAPT (0.50) HPGDHSD17B10MAPK1TSHRLIG1
SCHEMBL26011513 0.79 MAPT (0.42) HPGDHSD17B10MAPK1TSHRLIG1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-10326012-A None JP disclosed
EP-2662727-B1 Compound for resist and radiation-sensitive composition MITSUBISHI GAS CHEMICAL CO (JP) 2019-08-14 EP disclosed
EP-2669332-B1 Epoxy resin composition and light emitting apparatus LG INNOTEK CO LTD (KR) 2017-05-17 EP disclosed
EP-2669333-B1 EPOXY RESIN COMPOSITION AND LIGHT EMITTING APPARATUS LG INNOTEK CO LTD (KR) 2017-04-05 EP disclosed
EP-1739485-B1 RESIST COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2016-08-31 EP disclosed
EP-1830228-B1 COMPOUND FOR RESIST AND RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2015-08-05 EP disclosed
CN-103180355-B Phenolic oligomers and preparation method thereof MEIWA PLASTIC INDUSTRIES, LTD. (JP) 2015-08-05 CN disclosed
US-9048402-B2 Epoxy resin composition and light emitting apparatus LG INNOTEK CO., LTD. (KR) 2015-06-02 US disclosed
US-9024347-B2 Epoxy resin composition and light emitting apparatus LG INNOTEK CO., LTD. (KR) 2015-05-05 US disclosed
EP-2808736-A2 Compound for resist and radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-12-03 EP disclosed
US-20030068542-A1 Bipolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-04-10 US disclosed
EP-1298748-A2 Bipolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-04-02 EP disclosed
JP-H10326012-A POSITIVE RADIATION SENSITIVE COMPOSITION TORAY IND INC 1998-12-08 JP disclosed
US-5258427-A MIXTURE OF A LIQUID EPOXY RESIN, A METAL OXIDE AND A POLYHYDROXYARYL COMPOUND ICI AUSTRALIA OPERATIONS PROPRIETARY LTD. (AU) 1993-11-02 US disclosed
US-5209873-A ELECTRICALLY CONDUCTIVE PASTE AND COATING KAO CORPORATION (JP) 1993-05-11 US disclosed
US-5198571-A MONOFUNCTIONALIZATION OF PHENOLIC HYDROXY ONTO A POLYPHENOL ROUSSEL UCLAF (FR) 1993-03-30 US disclosed
EP-0491600-A1 Process for the regiospecific monofunctionalisation of a phenolic hydroxy group of a polyphenol ROUSSEL UCLAF (FR) 1992-06-24 EP disclosed
US-5102569-A Borating and alkylating in one pot CHEVRON RESEARCH AND TECHNOLOGY COMPANY (US) 1992-04-07 US disclosed
EP-0467119-A1 Electrically conductive paste and coating Kao Corporation (JP) 1992-01-22 EP disclosed
EP-0458521-A2 Heat curable adhesive ICI AUSTRALIA OPERATIONS PROPRIETARY LIMITED (AU) 1991-11-27 EP disclosed