Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.79 |
| ▸ | FAAH | O00519 | 6/20 | 0.79 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.62 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.62 |
| ▸ | PKM | P14618 | 1/20 | 0.62 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.62 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.62 |
| ▸ | BCHE | P06276 | 1/20 | 0.56 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.54 |
| ▸ | LMNA | P02545 | 1/20 | 0.54 |
| ▸ | CCR6 | P51684 | 1/20 | 0.54 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.54 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.54 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL95324 | 0.89 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL19511560 | 0.81 | MGLL (0.83) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL21630074 | 0.81 | MGLL (0.83) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL1321309 | 0.81 | MGLL (0.83) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL962950 | 0.77 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL140288 | 0.77 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL1190763 | 0.77 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL284697 | 0.77 | MGLL (0.75) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL9132838 | 0.77 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL2797893 | 0.77 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113845775-B | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2022-06-21 | — | — | CN | claimed |
| CN-112079868-A | Halogen-free flame-retardant cyclotriphosphazene maleimide resin, laminated board and preparation method thereof | 艾蒙特成都新材料科技有限公司 | 2020-12-15 | — | — | CN | claimed |
| CN-113614172-B | Resin composition and use thereof | 四国化成工业株式会社 | 2024-05-31 | — | — | CN | disclosed |
| CN-118104403-A | Curable adhesive composition, film-like adhesive, method for producing multilayer wiring board, and multilayer wiring board | 株式会社力森诺科 | 2024-05-28 | — | — | CN | disclosed |
| CN-114836034-A | Bismaleimide resin composition and application thereof | 江南大学 | 2022-08-02 | — | — | CN | disclosed |
| CN-113614172-A | Resin composition and use thereof | 四国化成工业株式会社 | 2021-11-05 | — | — | CN | disclosed |
| CN-111995867-B | Thermosetting resin composition for packaging third-generation semiconductor device and preparation method thereof | 江南大学 | 2021-10-12 | — | — | CN | disclosed |
| CN-112424283-A | Composition for forming optical member, compound and resin | 三菱瓦斯化学株式会社 | 2021-02-26 | — | — | CN | disclosed |
| CN-112204076-A | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2021-01-08 | — | — | CN | disclosed |
| CN-112079868-A | Halogen-free flame-retardant cyclotriphosphazene maleimide resin, laminated board and preparation method thereof | 艾蒙特成都新材料科技有限公司 | 2020-12-15 | — | — | CN | disclosed |
| WO-2020027206-A1 | OPTICAL COMPONENT-FORMING COMPOSITION, OPTICAL COMPONENT, COMPOUND, AND RESIN | 三菱瓦斯化学株式会社 | 2020-02-06 | — | — | WO | disclosed |
| US-5075453-A | Process for producing aryloxy-substituted phosphazene derivatives | NIPPON SODA CO., LTD. (JP) | 1991-12-24 | — | — | US | disclosed |
| US-4946734-A | MALEIMIDE SUBSTITUTED PHOSPHONITRILE | HITACHI, LTD. (JP) | 1990-08-07 | — | — | US | disclosed |