SCHEMBL9847733

SCHEMBL9847733

O=C(O)c1ccccc1-c1ccc(-c2cccc(C(=O)O)c2C(=O)O)c(C(=O)O)c1

nearest known ligand 0.51

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 4/20 0.51
ACMSD Q8TDX5 4/20 0.48
MCL1 Q07820 3/20 0.48
PTPN11 Q06124 2/20 0.47
HNF4A P41235 2/20 0.46
HSD17B10 Q99714 1/20 0.46
MYC P01106 1/20 0.45
CYP3A4 P08684 1/20 0.44
CYP2C9 P11712 1/20 0.44
ALOX12 P18054 1/20 0.44
LMNA P02545 1/20 0.43
EIF4E P06730 3/20 0.43
DHFR P00374 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL809021 0.86 FOLH1 (0.61) FOLH1HNF4AHSD17B10MYCCYP3A4
SCHEMBL87895 0.83 CDC25B (0.49) FOLH1ACMSDMCL1PTPN11HNF4A
SCHEMBL5487096 0.82 ACMSD (0.61) FOLH1ACMSDMCL1HNF4ACYP3A4
SCHEMBL28679459 0.81 CDC25B (0.47) FOLH1ACMSDMCL1PTPN11HNF4A
Pyromellitic Acid SCHEMBL15228126 0.81 CDC25B (0.47) FOLH1ACMSDMCL1PTPN11HNF4A
Water SCHEMBL9437059 0.81 CDC25B (0.47) FOLH1ACMSDMCL1PTPN11HNF4A
Water SCHEMBL6403598 0.81 CDC25B (0.47) FOLH1ACMSDMCL1PTPN11HNF4A
SCHEMBL9240427 0.81 CDC25B (0.47) FOLH1ACMSDMCL1HNF4AHSD17B10
SCHEMBL29575085 0.81 CDC25B (0.47) FOLH1ACMSDMCL1PTPN11HNF4A
SCHEMBL28020470 0.81 HNF4A (0.55) FOLH1ACMSDMCL1HNF4AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-62265327-A None JP disclosed
CN-118265745-A Polyimide film, high-frequency circuit board, and flexible electronic device board UBE株式会社 2024-06-28 CN disclosed
US-20220085374-A1 ELECTRODE FOR ALL-SOLID SECONDARY BATTERY, ALL-SOLID SECONDARY BATTERY, AND METHOD OF PRODUCING ALL-SOLID SECONDARY BATTERY UBE CORPORATION (JP) 2022-03-17 US disclosed
CN-112399980-B Binder resin composition for electrode, electrode mixture paste, and electrode 宇部兴产株式会社 2022-01-14 CN disclosed
EP-3905387-A1 ELECTRODE FOR ALL-SOLID-STATE SECONDARY BATTERIES, ALL-SOLID-STATE SECONDARY BATTERY AND METHOD FOR PRODUCING ALL-SOLID-STATE SECONDARY BATTERY Ube Industries, Ltd. (JP) 2021-11-03 EP disclosed
CN-111417605-B Solution for coating glass substrate 尤尼吉可株式会社 2021-10-15 CN disclosed
CN-113243056-A Electrode for all-solid-state secondary battery, and method for manufacturing all-solid-state secondary battery 宇部兴产株式会社 2021-08-10 CN disclosed
CN-112399980-A Binder resin composition for electrode, electrode mixture paste, and electrode 宇部兴产株式会社 2021-02-23 CN disclosed
CN-111417605-A Solution for coating glass substrate 尤尼吉可株式会社 2020-07-14 CN disclosed
CN-109643803-B Binder resin for electrode, electrode mixture paste, electrode, and method for producing electrode 宇部兴产株式会社 2020-04-17 CN disclosed
EP-0456512-A2 Polyimidesiloxane oligomer SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-11-13 EP disclosed
JP-S62265327-A NOVEL POLYAMIC ACID OR POLYAMIC ESTER AND NOVEL POLYIMIDE HITACHI CHEM CO LTD 1987-11-18 JP disclosed