SCHEMBL984967

SCHEMBL984967

COC(C)(C)CCCC(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.46
ALDH1A1 P00352 3/20 0.45
LMNA P02545 2/20 0.43
SLC22A6 Q4U2R8 2/20 0.43
NFKB1 P19838 1/20 0.42
PMP22 Q01453 1/20 0.42
AKR1B1 P15121 1/20 0.41
GPR84 Q9NQS5 7/20 0.39
PPARG P37231 6/20 0.39
PPARD Q03181 6/20 0.39
PPARA Q07869 6/20 0.39
HDAC11 Q96DB2 5/20 0.39
TLR2 O60603 2/20 0.39
TDP1 Q9NUW8 2/20 0.39
FABP4 P15090 2/20 0.39
PTPN1 P18031 2/20 0.39
SLC22A8 Q8TCC7 1/20 0.39
MEN1 O00255 1/20 0.39
ESR1 P03372 1/20 0.39
ALOX15 P16050 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL157395 0.93 ALDH1A1 (0.48) TSHRALDH1A1LMNASLC22A6NFKB1
SCHEMBL986920 0.91 ALDH1A1 (0.52) TSHRALDH1A1LMNASLC22A6NFKB1
SCHEMBL21933577 0.89 ALDH1A1 (0.41) TSHRALDH1A1LMNASLC22A6NFKB1
SCHEMBL30955715 0.87 AKR1B1 (0.41) TSHRALDH1A1SLC22A6AKR1B1GPR84
SCHEMBL12410508 0.86 NAALAD2 (0.43) TSHRALDH1A1LMNASLC22A6NFKB1
SCHEMBL29807574 0.86 ALDH1A1 (0.39) TSHRALDH1A1LMNASLC22A6NFKB1
SCHEMBL11232780 0.82 ALDH1A1 (0.39) TSHRALDH1A1LMNATDP1
SCHEMBL31214626 0.80 TSHR (0.58) TSHRALDH1A1LMNAMEN1KMT2A
SCHEMBL1623793 0.79 TET2 (0.38) TSHRALDH1A1LMNATDP1
SCHEMBL27567558 0.78 TSHR (0.43) TSHRALDH1A1LMNASLC22A6NFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 663 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240400951-A1 COMPOSTION AND ITS USE IN CLEANING APPLICATIONS INTELLIGENT FLUIDS GMBH (DE) 2024-12-05 US claimed
EP-4408962-A1 COMPOSITION AND ITS USE IN CLEANING APPLICATIONS intelligent fluids GmbH (DE) 2024-08-07 EP claimed
CN-118043441-A Compositions and their use in cleaning applications 智能流体有限公司 2024-05-14 CN claimed
EP-2781637-B1 NONWOVEN FABRIC FORMED FROM FIBER COATED WITH ORGANIC BINDER POLYMER COMPOUND, ELECTROCHEMICAL DEVICE COMPRISING NONWOVEN FABRIC, AND METHOD FOR MANUFACTURING NONWOVEN FABRIC LG ENERGY SOLUTION LTD (KR) 2024-02-21 EP claimed
WO-2023170577-A1 USE OF A HYDROPHOBIC POLYMER ON DECORATIVE PANELS AND METHOD FLOORING INDUSTRIES LIMITED, SARL (LU) 2023-09-14 WO claimed
WO-2023052548-A1 COMPOSITION AND ITS USE IN CLEANING APPLICATIONS INTELLIGENT FLUIDS GMBH (DE) 2023-04-06 WO claimed
EP-4155376-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP claimed
EP-4155375-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP claimed
EP-3473783-B1 METHOD FOR MANUFACTURING FLOOR BOARDS ALADDIN MFG CORP (US) 2020-07-08 EP claimed
US-20200183284-A1 METHOD AND COMPOSITION FOR IMPROVING LWR IN PATTERNING STEP USING NEGATIVE TONE PHOTORESIST YCCHEM CO., LTD. (KR) 2020-06-11 US claimed
EP-2157477-B1 USE OF A RESIST COMPOSITION FOR NEGATIVE WORKING-TYPE DEVELOPMENT, AND METHOD FOR PATTERN FORMATION USING THE RESIST COMPOSITION FUJIFILM CORP (JP) 2014-08-06 EP claimed
EP-1847878-B1 PHOTOSENSITIVE COMPOSITION REMOVING LIQUID SHOWA DENKO KK (JP) 2012-10-31 EP claimed
US-8241840-B2 Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method FUJIFILM CORPORATION (JP) 2012-08-14 US claimed
EP-2001289-B1 AQUEOUS MICROEMULSIONS CONTAINING PYRETHROID COMPOUNDS BASF SE (DE) 2012-06-13 EP claimed
US-8034547-B2 Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method FUJIFILM CORPORATION (JP) 2011-10-11 US claimed
US-20100330507-A1 PATTERN FORMING METHOD, RESIST COMPOSITION TO BE USED IN THE PATTERN FORMING METHOD, NEGATIVE DEVELOPING SOLUTION TO BE USED IN THE PATTERN FORMING METHOD AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT TO BE USED IN THE PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2010-12-30 US claimed
EP-1170343-B1 INFRARED SENSITIVE COATING LIQUID ASAHI KASEI CHEMICALS CORP (JP) 2005-11-02 EP claimed
EP-1016698-B1 Use of a solvent composition containing an oxyisobutyric acid ester as a solvent in coatings, adhesives and printing inks MITSUBISHI RAYON CO (JP) 2004-09-22 EP claimed
EP-0629671-B1 Solvent composition MITSUBISHI RAYON CO (JP) 2002-03-27 EP claimed
EP-0260994-B1 PROCESS FOR PRODUCING INTEGRATED CIRCUIT JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-07-15 EP claimed