SCHEMBL9852640

SCHEMBL9852640

COc1cc(C2=CC(=O)NC2=O)cc(C2=CC(=O)NC2=O)c1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A1 P04798 4/20 0.38
CYP1B1 Q16678 4/20 0.38
CYP1A2 P05177 2/20 0.38
CYP2E1 P05181 2/20 0.38
CYP3A4 P08684 2/20 0.38
CYP2C8 P10632 2/20 0.38
CYP2D6 P10635 2/20 0.38
CYP2A6 P11509 2/20 0.38
CYP2C9 P11712 2/20 0.38
CYP4B1 P13584 2/20 0.38
CYP2B6 P20813 2/20 0.38
CYP3A5 P20815 2/20 0.38
CYP2A7 P20853 2/20 0.38
CYP3A7 P24462 2/20 0.38
CYP2F1 P24903 2/20 0.38
CYP2C18 P33260 2/20 0.38
CYP2C19 P33261 2/20 0.38
CYP2J2 P51589 2/20 0.38
CYP4F2 P78329 2/20 0.38
CYP4F8 P98187 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11335125 0.96 ALDH1A1 (0.41) CYP1A1CYP1B1CYP1A2CYP2E1CYP3A4
SCHEMBL3671037 0.83 GAA (0.50) ALDH1A1CHEK1KDM4EGAANCOA1
Ammonia Solution, Strong SCHEMBL27959157 0.82 GAA (0.49) ALDH1A1CHEK1KDM4EGAANCOA1
SCHEMBL3676452 0.81 BACE1 (0.58) BACE1KDM4EMAPTPKMTDP1
Ammonia Solution, Strong SCHEMBL27959172 0.80 BACE1 (0.56) BACE1KDM4EMAPTPKMTDP1
SCHEMBL7800993 0.79 ALDH1A1 (0.32) ALDH1A1
SCHEMBL29576497 0.75 PTPRC (0.37)
SCHEMBL9323186 0.75 NOTUM (0.35) ALDH1A1RXRA
SCHEMBL11327793 0.74 L3MBTL1 (0.49) KDM4EMAPTTHRB
SCHEMBL167921 0.72 PTP4A3 (0.33) BACE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117539127-A Composition for forming resist underlayer film containing amide solvent 日产化学株式会社 2024-02-09 CN disclosed
CN-110192152-B Composition for forming resist underlayer film containing amide solvent 日产化学株式会社 2023-11-03 CN disclosed
CN-115975155-A Composition for forming cured film for alignment material, and retardation material 日产化学株式会社 2023-04-18 CN disclosed
CN-114096598-A Thermally expandable composition comprising a chemical blowing agent SIKA技术股份公司 2022-02-25 CN disclosed
EP-3331959-A1 ANIONIC CURABLE COMPOSITIONS Designer Molecules, Inc. (US) 2018-06-13 EP disclosed
WO-2017027482-A1 ANIONIC CURABLE COMPOSITIONS DESIGNER MOLECULES, INC. (US) 2017-02-16 WO disclosed
EP-0422379-A2 Thermosetting resin composition, resin sheet, prepreg and laminated sheet NITTO DENKO CORPORATION (JP) 1991-04-17 EP disclosed