SCHEMBL9869403

SCHEMBL9869403

CC1(C)CCCC(C)(C)N1C(=O)C1CCCCC1

nearest known ligand 0.47

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 10/20 0.47
TSHR P16473 2/20 0.47
ALDH1A1 P00352 2/20 0.47
RECQL P46063 1/20 0.46
LMNA P02545 1/20 0.44
GAA P10253 1/20 0.42
HSD11B2 P80365 2/20 0.41
SMN1; SMN2 Q16637 1/20 0.40
GRM5 P41594 1/20 0.40
CES2 O00748 1/20 0.39
CES1 P23141 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1311550 0.73 SMN1; SMN2 (0.41) HSD11B1TSHRALDH1A1RECQLLMNA
SCHEMBL11436628 0.72 HTT (0.50) ALDH1A1LMNASMN1; SMN2
SCHEMBL28088669 0.71 TSHR (0.45) TSHRALDH1A1
SCHEMBL25840964 0.71 ALDH1A1 (0.67) HSD11B1TSHRALDH1A1LMNAHSD11B2
SCHEMBL16468548 0.69 CYP2C19 (0.39) TSHRALDH1A1
SCHEMBL8613670 0.69 TSHR (0.43) TSHRLMNASMN1; SMN2
SCHEMBL28448964 0.69 TSHR (0.43) TSHR
SCHEMBL9067554 0.69 TSHR (0.48) TSHR
SCHEMBL10574423 0.69 TSHR (0.43) TSHRLMNASMN1; SMN2
SCHEMBL25810399 0.68 ALDH1A1 (0.63) HSD11B1TSHRALDH1A1LMNAHSD11B2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115113484-A Positive photosensitive resin composition, positive photosensitive dry film, method for producing the same, and method for forming pattern 信越化学工业株式会社 2022-09-27 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-114253069-A Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, and surface protective film 信越化学工业株式会社 2022-03-29 CN disclosed
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
CN-107561863-A Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2018-01-09 CN disclosed
CN-106909028-A Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2017-06-30 CN disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 US disclosed
US-20150293449-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-10-15 US disclosed
CN-104950580-A Photosensitive polysiloxane composition and application thereof CHI MEI CORP 2015-09-30 CN disclosed
CN-104375381-A Photosensitive polysiloxane composition, film formed by photosensitive polysiloxane composition and device comprising film CHI MEI CORP 2015-02-25 CN disclosed
US-20150050596-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-02-19 US disclosed
US-5013774-A Imidized acrylics, tetramethylpiperidine stabilizer, weatherproofing MITSUBISHI RAYON COMPANY, LTD. (JP) 1991-05-07 US disclosed
EP-0332136-A2 Thermoplastic methacrylimide group-containing resin composition MITSUBISHI RAYON CO., LTD. (JP) 1989-09-13 EP disclosed