⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6114 | 0.97 | — | — | |
| SCHEMBL6912035 | 0.93 | — | — | |
| SCHEMBL1506823 | 0.93 | — | — | |
| SCHEMBL9396203 | 0.93 | — | — | |
| SCHEMBL1506846 | 0.93 | — | — | |
| SCHEMBL1506863 | 0.93 | — | — | |
| SCHEMBL1506866 | 0.93 | — | — | |
| SCHEMBL5969550 | 0.93 | — | — | |
| SCHEMBL2467242 | 0.93 | — | — | |
| SCHEMBL1506849 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103177797-B | The composition for forming dielectric film, the dielectric film for forming the method for dielectric film and being formed by methods described | 三菱综合材料株式会社 | 2017-10-10 | — | — | CN | claimed |
| EP-2431986-B1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORP (JP) | 2017-06-21 | — | — | EP | claimed |
| US-9595393-B2 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORPORATION (JP) | 2017-03-14 | — | — | US | claimed |
| US-9018118-B2 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORPORATION (JP) | 2015-04-28 | — | — | US | claimed |
| EP-2608219-B1 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORP (JP) | 2015-03-04 | — | — | EP | claimed |
| CN-103177797-A | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORP | 2013-06-26 | — | — | CN | claimed |
| EP-2608219-A1 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2013-06-26 | — | — | EP | claimed |
| US-20130155571-A1 | DIELECTRIC THIN FILM-FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM AND DIELECTRIC THIN FILM FORMED BY THE METHOD | STMicroelectronics(Tours) SAS (FR) | 2013-06-20 | — | — | US | claimed |
| CN-103068807-A | Method for producing phenyl-substituted heterocyclic derivative by means of coupling method using a palladium compound | TEIJIN PHARMA LTD | 2013-04-24 | — | — | CN | claimed |
| CN-102436866-A | Dielectric film-forming composition, method for forming dielectric film and dielectric film formed by the method | MITSUBISHI MATERIALS CORP | 2012-05-02 | — | — | CN | claimed |
| EP-2431986-A1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2012-03-21 | — | — | EP | claimed |
| US-20120055372-A1 | DIELECTRIC-THIN-FILM FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM, AND DIELECTRIC THIN FILM FORMED BY THE METHOD | MITSUBISHI MATERIALS CORPORATION (JP) | 2012-03-08 | — | — | US | claimed |
| CN-107073516-B | Method for producing structure having concave pattern, resin composition, method for forming conductive film, electronic circuit, and electronic device | JSR株式会社 | 2020-09-15 | — | — | CN | disclosed |
| CN-105143977-B | Method for producing substrate having concave pattern, composition, method for forming conductive film, electronic circuit, and electronic device | JSR株式会社 | 2020-01-07 | — | — | CN | disclosed |
| EP-3409729-B1 | ELECTROCONDUCTIVE COMPOSITION, PRODUCTION PROCESS THEREFOR, AND ELECTROCONDUCTIVE MATERIAL | TOYO INK SC HOLDINGS CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| US-10392699-B2 | Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device | JSR CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| CN-102436866-A | Dielectric film-forming composition, method for forming dielectric film and dielectric film formed by the method | MITSUBISHI MATERIALS CORP | 2012-05-02 | — | — | CN | disclosed |
| EP-2431986-A1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2012-03-21 | — | — | EP | disclosed |
| US-20120055372-A1 | DIELECTRIC-THIN-FILM FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM, AND DIELECTRIC THIN FILM FORMED BY THE METHOD | MITSUBISHI MATERIALS CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| EP-2426684-A1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORPORATION (JP) | 2012-03-07 | — | — | EP | disclosed |