SCHEMBL5969550

SCHEMBL5969550

CCC(CC)C(=O)O.[AlH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6114 0.97 — —
Acetic Acid SCHEMBL22445079 0.94 CA2 (0.61) —
SCHEMBL98743 0.93 — —
SCHEMBL6912035 0.93 — —
SCHEMBL2467242 0.93 — —
SCHEMBL1506863 0.93 — —
SCHEMBL1506866 0.93 — —
SCHEMBL1506823 0.93 — —
SCHEMBL1506846 0.93 — —
Ammonia Solution, Strong SCHEMBL5978991 0.93 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12534563-B2 Block copolymer, resin composition, stretch conductor, electronic device, and pressure-sensitive adhesive film ARTIENCE CO., LTD. (JP) 2026-01-27 — — US disclosed
CN-117413037-A Adhesive composition, adhesive, and surface protective film 日东电工株式会社 2024-01-16 — — CN disclosed
US-20230050336-A1 BLOCK COPOLYMER, RESIN COMPOSITION, STRETCH CONDUCTOR, ELECTRONIC DEVICE, AND PRESSURE-SENSITIVE ADHESIVE FILM TOYO INK SC HOLDINGS CO., LTD. (JP) 2023-02-16 — — US disclosed
CN-115477906-A Adhesive composition, adhesive sheet, and electronic device 味之素株式会社 2022-12-16 — — CN disclosed
WO-2022091601-A1 ADDITION-CURABLE LIQUID SILICONE RUBBER COMPOSITION FOR FLAME RETARDANT AIR BAGS 信越化学工業株式会社 2022-05-05 — — WO disclosed
CN-113801332-A Toughness modification method of acrylic material and acrylic material 浙江力行得科技有限公司 2021-12-17 — — CN disclosed
WO-2021117723-A1 BLOCK COPOLYMER, RESIN COMPOSITION, STRETCH CONDUCTOR, ELECTRONIC DEVICE, AND PRESSURE-SENSITIVE ADHESIVE FILM 東洋インキSCホールディングス株式会社 2021-06-17 — — WO disclosed
WO-2021059936-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR DEVICE 信越化学工業株式会社 2021-04-01 — — WO disclosed
CN-103964838-A Dielectric thin film-forming composition and method of forming dielectric thin film MITSUBISHI MATERIALS CORP 2014-08-06 — — CN disclosed
US-20140212576-A1 DIELECTRIC THIN FILM-FORMING COMPOSITION AND METHOD OF FORMING DIELECTRIC THIN FILM USING THE SAME MITSUBISHI MATERIALS CORPORATION (JP) 2014-07-31 — — US disclosed
EP-0914942-B1 Directly imageable waterless planographic printing plate precursor and a method of producing planographic printing plates TORAY INDUSTRIES (JP) 2005-05-25 — — EP disclosed
EP-1038669-B1 Method of producing directly imageable waterless planographic printing plate TORAY INDUSTRIES (JP) 2005-01-26 — — EP disclosed
EP-1481802-A1 Directly imageable planographic printing plate precursor and a method of producing planographic printing plate TORAY INDUSTRIES, INC. (JP) 2004-12-01 — — EP disclosed
US-6777156-B1 HIGH SENSITIVITY AND HIGH IMAGE REPRODUCIBILITY; EASILY MADE WITHOUT WATER TORAY INDUSTRIES, INC. (JP) 2004-08-17 — — US disclosed
US-20030228540-A1 Heat sensitive elements; organometallic compound TORAY INDUSTRIES, INC. (JP) 2003-12-11 — — US disclosed
US-6284433-B1 IMAGEWISELY IRRADIATING PRECURSOR OF PRINTING PLATE WITH LASER BEAM, PRE-TREATING PRECURSOR WITH GLYCOL COMPOUND AND/OR A GLYCOL ETHER COMPOUND; REMOVING INK REPELLENT LAYER WHEREIN HEAT SENSITIVE LAYER IS PARTIALLY LEFT ON PRINTING PLATE TORAY INDUSTRIES, INC. (JP) 2001-09-04 — — US disclosed
EP-1038669-A1 Method of producing directly imageable waterless planographic printing plate TORAY INDUSTRIES, INC. (JP) 2000-09-27 — — EP disclosed
EP-0914942-A2 Directly imageable waterless planographic printing plate precursor and a method of producing planographic printing plates TORAY INDUSTRIES, INC. (JP) 1999-05-12 — — EP disclosed
US-5296298-A Polysiloxane, polyhydrogensiloxane, unsaturated coupling agent, epoxyalkylalkoxysilane, aluminum chelate compound, platinum and/or platinum compound TOSHIBA SILICONE CO., LTD. (JP) 1994-03-22 — — US disclosed
US-4055634-A ALUMINUM ALKOXIDE HOFFMANN-LA ROCHE, INC. (US) 1977-10-25 — — US disclosed
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