SCHEMBL9879524

SCHEMBL9879524

CC(C)(NCCNC(C)(C)P(=O)(O)O)P(=O)(O)O

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.43
FDPS P14324 10/20 0.41
ADRB3 P13945 1/20 0.35
PDE4D Q08499 1/20 0.35
PDE3A Q14432 1/20 0.35
PGK1 P00558 2/20 0.33
PGK2 P07205 2/20 0.33
GRM4 Q14833 1/20 0.33
MMP1 P03956 1/20 0.32
MMP2 P08253 1/20 0.32
MMP3 P08254 1/20 0.32
MMP9 P14780 1/20 0.32
CA2 P00918 1/20 0.32
GGPS1 O95749 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3849555 0.83 MMP2 (0.47) FDPSMMP1MMP2GGPS1
SCHEMBL10823997 0.81 S1PR2 (0.47) FDPSGGPS1
SCHEMBL11411859 0.76 LMNA (0.38) LMNAFDPS
SCHEMBL4147247 0.70 LMNA (0.56) LMNAFDPSPGK1PGK2GRM4
SCHEMBL3378873 0.69
SCHEMBL5463500 0.69 LMNA (0.47) LMNAFDPSPGK1PGK2GRM4
SCHEMBL8352003 0.69
SCHEMBL7074250 0.69 MMP2 (0.41) LMNAFDPSMMP1MMP2MMP3
SCHEMBL4102808 0.67 LMNA (0.39) LMNAFDPSADRB3PDE4DPDE3A
SCHEMBL11059094 0.67 LMNA (0.39) LMNAFDPSADRB3PDE4DPDE3A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-3294484-A None JP disclosed
US-9150758-B2 Polishing composition, polishing method using same, and method for producing semiconductor device FUJIMI INCORPORATED (JP) 2015-10-06 US disclosed
US-20140141612-A1 POLISHING COMPOSITION, POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE FUJIMI CORPORATION 2014-05-22 US disclosed
EP-2693460-A1 POLISHING COMPOSITION, POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Fujimi Incorporated (JP) 2014-02-05 EP disclosed
JP-H03294484-A ELECTROLESS GOLD PLATING SOLUTION HITACHI LTD 1991-12-25 JP disclosed
EP-0070061-B1 A SOLUTION FOR THE ELECTROLESS DEPOSITION OF GOLD-ALLOYS ONTO A SUBSTRATE Koninklijke Philips Electronics N.V. (NL) 1986-01-15 EP disclosed