SCHEMBL9906142

SCHEMBL9906142

Cc1ccc(C(C)(C)NC(C)(C)c2ccc(C)cc2)cc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.57
ACHE P22303 4/20 0.44
TDP1 Q9NUW8 1/20 0.44
NPC1 O15118 3/20 0.42
RAB9A P51151 3/20 0.42
MAPT P10636 2/20 0.42
ALDH1A1 P00352 2/20 0.37
GAA P10253 1/20 0.37
CA1 P00915 2/20 0.37
CA2 P00918 2/20 0.37
CA9 Q16790 2/20 0.37
CA5A P35218 1/20 0.37
HDAC1 Q13547 1/20 0.36
HDAC6 Q9UBN7 1/20 0.36
CYP19A1 P11511 1/20 0.35
CA7 P43166 1/20 0.35
HPGD P15428 1/20 0.33
MLYCD O95822 1/20 0.33
ATM Q13315 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18591715 0.90 TSHR (0.52) TSHRACHETDP1NPC1RAB9A
SCHEMBL8354799 0.81 TSHR (0.55) TSHRACHETDP1NPC1RAB9A
SCHEMBL8029072 0.79 TSHR (0.52) TSHRACHETDP1NPC1RAB9A
SCHEMBL8351698 0.77 ACACB (0.49) TSHRTDP1NPC1RAB9AMAPT
SCHEMBL22430335 0.75 TSHR (0.48) TSHRACHETDP1NPC1RAB9A
SCHEMBL471139 0.74 KCNN4 (0.48) TSHRMAPTALDH1A1HDAC1HDAC6
SCHEMBL10066565 0.74 TSHR (0.46) TSHRACHETDP1NPC1RAB9A
SCHEMBL8446830 0.74 NPC1 (0.48) TSHRNPC1RAB9AMAPTALDH1A1
SCHEMBL18901114 0.73 TSHR (0.67) TSHRACHETDP1NPC1RAB9A
SCHEMBL4942966 0.73 TSHR (0.67) TSHRACHETDP1NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021263086-A1 BRAIDED JACKETS WITH LOW THICKNESS KURARAY CO., LTD. (JP) 2021-12-30 WO disclosed
US-8785534-B2 Use of polyamides that are resistant to corrosion and stress cracking BASF SE (DE) 2014-07-22 US disclosed
US-8785534-B2 Use of polyamides that are resistant to corrosion and stress cracking BASF SE (DE) 2014-07-22 US disclosed
EP-2553021-B1 USE OF POLYAMIDES THAT ARE RESISTANT TO CORROSION AND STRESS CRACKING BASF SE (DE) 2014-05-07 EP disclosed
US-8481652-B2 Thermoplastic polyamides having polyether amines BASF SE (DE) 2013-07-09 US disclosed
US-8481652-B2 Thermoplastic polyamides having polyether amines BASF SE (DE) 2013-07-09 US disclosed
US-20130023613-A1 USE OF POLYAMIDES THAT ARE RESISTANT TO CORROSION AND STRESS CRACKING BASF SE (DE) 2013-01-24 US disclosed
US-20130023613-A1 USE OF POLYAMIDES THAT ARE RESISTANT TO CORROSION AND STRESS CRACKING BASF SE (DE) 2013-01-24 US disclosed
US-8197715-B2 Thermoplastic moulding compositions having improved ductility BASE SE (DE) 2012-06-12 US disclosed
US-8197715-B2 Thermoplastic moulding compositions having improved ductility BASE SE (DE) 2012-06-12 US disclosed
US-20100090174-A1 THERMOPLASTIC MOULDING COMPOSITIONS HAVING IMPROVED DUCTILITY BASF SE (DE) 2010-04-15 US disclosed
US-20100090174-A1 THERMOPLASTIC MOULDING COMPOSITIONS HAVING IMPROVED DUCTILITY BASF SE (DE) 2010-04-15 US disclosed
WO-2010028975-A2 THERMALLY CONDUCTIVE POLYAMIDE HAVING INCREASED FLOW CAPABILITY BASF SE (DE) 2010-03-18 WO disclosed
EP-2049597-B1 THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS BASF SE (DE) 2010-02-24 EP disclosed
US-20100019210-A1 THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS BASF SE (DE) 2010-01-28 US disclosed
WO-2009115535-A2 POLYAMIDE NANOCOMPOSITES WITH HYPER- BRANCHED POLYETHERAMINES BASF SE (DE) 2009-09-24 WO disclosed
WO-2009115536-A1 POLYAMIDE NANOCOMPOSITES WITH HYPER-BRANCHED POLYETHYLENIMINES BASF SE (DE) 2009-09-24 WO disclosed
WO-2009077492-A2 THERMOPLASTIC POLYAMIDES HAVING POLYETHER AMINES BASF SE (DE) 2009-06-25 WO disclosed
WO-2008074687-A2 THERMOPLASTIC MOULDING COMPOSITIONS HAVING IMPROVED DUCTILITY BASF SE (DE) 2008-06-26 WO disclosed
WO-2008012233-A2 THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS BASF SE (DE) 2008-01-31 WO disclosed