SCHEMBL99074

SCHEMBL99074

N#CC=CC(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1013554 1.00
SCHEMBL99073 1.00
SCHEMBL17356122 0.75
SCHEMBL7589489 0.75 ALDH1A1 (0.39)
SCHEMBL7589484 0.75 ALDH1A1 (0.39)
SCHEMBL15940374 0.67
SCHEMBL29272599 0.67 ALDH1A1 (0.53)
SCHEMBL5823406 0.67
SCHEMBL7591759 0.67
SCHEMBL7591758 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 267 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3345211-B1 NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES AIR LIQUIDE (FR) 2025-12-10 EP claimed
CN-118661297-A Adhesive for positive electrode plate, synthesis method thereof, positive electrode plate comprising adhesive, secondary battery and power utilization device 宁德时代新能源科技股份有限公司 2024-09-17 CN claimed
WO-2024011371-A1 BINDER FOR POSITIVE ELECTRODE PLATE AND SYNTHESIS METHOD THEREFOR, POSITIVE ELECTRODE PLATE COMPRISING SAME, SECONDARY BATTERY AND ELECTRIC DEVICE 宁德时代新能源科技股份有限公司 2024-01-18 WO claimed
CN-107924842-B Nitrogen-containing compounds for etching semiconductor structures 乔治洛德方法研究和开发液化空气有限公司 2022-09-06 CN claimed
CN-109796768-B LED packaging material and preparation method thereof 湖南七纬科技有限公司 2021-12-07 CN claimed
US-20190326126-A1 METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES AIR LIQUIDE ELECTRONICS U.S. LP 2019-10-24 US claimed
US-10347498-B2 Methods of minimizing plasma-induced sidewall damage during low K etch processes L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) 2019-07-09 US claimed
US-20180211845-A1 METHODS OF MINIMIZING PLASMA-INDUCED SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) 2018-07-26 US claimed
US-20170110336-A1 METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) 2017-04-20 US claimed
US-8697295-B2 Nonaqueous electrolytic solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEMICAL CORPORATION (JP) 2014-04-15 US claimed
US-6967236-B1 Methods of processing and synthesizing electrically conductive polymers and precursors thereof to form electrically conductive polymers having high electrical conductivity INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2005-11-22 US claimed
EP-3345211-B1 NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES AIR LIQUIDE (FR) 2025-12-10 EP disclosed
EP-4658660-A1 MACROCYCLIC OREXIN RECEPTOR AGONISTS AND USES THEREOF Jazz Pharmaceuticals Ireland Limited (IE) 2025-12-10 EP disclosed
WO-2025215153-A1 PRMT5 INHIBITORS Ryvu Therapeutics S.A. (PL) 2025-10-16 WO disclosed
CN-119855704-A Coated article and method for producing same 信越化学工业株式会社 2025-04-18 CN disclosed
EP-0469262-A2 Process for the preparation of insecticidal acaridical and nematicidal 2-aryl-5-(trifluoromethyl) pyrrole compounds AMERICAN CYANAMID COMPANY (US) 1992-02-05 EP disclosed
US-5068390-A Chemical intermediates for insecticides, miticides and nematocides AMERICAN CYANAMID COMPANY (US) 1991-11-26 US disclosed
EP-0399949-A1 Substituted aminoalkylphosphinic acids CIBA-GEIGY AG (CH) 1990-11-28 EP disclosed
US-4024292-A Process for developing latent electrostatic images with ink XEROX CORPORATION (US) 1977-05-17 US disclosed
US-3954640-A Electrostatic printing inks XEROX CORPORATION (US) 1976-05-04 US disclosed