SCHEMBL9930372

SCHEMBL9930372

CC(C)CCN(O)CCC(C)C

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.46
CA1 P00915 5/20 0.33
KDM4C Q9H3R0 2/20 0.33
KDM4A O75164 1/20 0.33
PHF8 Q9UPP1 1/20 0.33
KDM2A Q9Y2K7 1/20 0.33
TSHR P16473 1/20 0.33
CA12 O43570 3/20 0.32
CA2 P00918 3/20 0.32
CA9 Q16790 3/20 0.32
LMNA P02545 1/20 0.32
OPRM1 P35372 2/20 0.31
OPRD1 P41143 2/20 0.31
OPRK1 P41145 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4969707 0.81 LMNA (0.41) ALDH1A1CA1KDM4CKDM4APHF8
SCHEMBL31625357 0.80
SCHEMBL23223042 0.75
SCHEMBL19683759 0.73 KDM4C (0.35) ALDH1A1KDM4CKDM4APHF8KDM2A
SCHEMBL472095 0.72 ALDH1A1 (0.43) ALDH1A1CA1CA12CA2CA9
SCHEMBL2142405 0.72 CA1 (0.41) ALDH1A1CA1TSHRCA12CA2
SCHEMBL21077345 0.69 ALDH1A1 (0.43) ALDH1A1
SCHEMBL3563151 0.69
SCHEMBL14464203 0.69
SCHEMBL3563153 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12312569-B2 Kit for cleaning agent and method for preparing cleaning agent FUJIFILM CORPORATION (JP) 2025-05-27 US disclosed
US-11385548-B2 Process liquid and method of processing substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-12 US disclosed
US-20210395645-A1 CLEANING LIQUID FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) 2021-12-23 US disclosed
US-20210317391-A1 KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) 2021-10-14 US disclosed
US-20200241424-A1 PROCESS LIQUID AND METHOD OF PROCESSING SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-07-30 US disclosed
WO-2020137359-A1 KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT 富士フイルムエレクトロニクスマテリアルズ株式会社 2020-07-02 WO disclosed
US-9862914-B2 Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2018-01-09 US disclosed
EP-3051577-B1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE WAKO PURE CHEM IND LTD (JP) 2017-10-18 EP disclosed
US-20160272924-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2016-09-22 US disclosed
EP-3051577-A1 CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE Wako Pure Chemical Industries, Ltd. (JP) 2016-08-03 EP disclosed
US-9034810-B2 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-19 US disclosed
US-9006164-B2 Resist remover composition and method for removing resist using the composition WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-04-14 US disclosed
EP-2474862-B1 COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION WAKO PURE CHEM IND LTD (JP) 2015-02-25 EP disclosed
EP-2647693-A1 SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE Wako Pure Chemical Industries, Ltd. (JP) 2013-10-09 EP disclosed
US-20130261040-A1 SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-03 US disclosed
EP-2474862-A1 RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION Wako Pure Chemical Industries, Ltd. (JP) 2012-07-11 EP disclosed
EP-2475000-A1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME Wako Pure Chemical Industries, Ltd. (JP) 2012-07-11 EP disclosed
US-20120172274-A1 RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-07-05 US disclosed
US-20120157368-A1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-06-21 US disclosed
WO-2007108968-A2 OPHTHALMIC COMPOSITIONS FOR TREATING OCULAR HYPERTENSION MERCK & CO., INC. (US) 2007-09-27 WO disclosed