SCHEMBL994719

SCHEMBL994719

CCC(CC)(CC)C(=O)CC(=O)O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LDHA P00338 1/20 0.42
SRR Q9GZT4 1/20 0.42
FFAR3 O14843 2/20 0.40
HDAC3 O15379 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC2 Q92769 1/20 0.35
HDAC8 Q9BY41 1/20 0.35
MEN1 O00255 1/20 0.33
ALDH1A1 P00352 1/20 0.33
CYP1A2 P05177 1/20 0.33
THRB P10828 1/20 0.33
KMT2A Q03164 1/20 0.33
HMGCR P04035 1/20 0.32
CHRM1 P11229 1/20 0.32
TBXA2R P21731 1/20 0.32
ADRA1A P35348 1/20 0.32
CYP2D6 P10635 1/20 0.31
TSHR P16473 1/20 0.31
CYP2C19 P33261 1/20 0.31
HIF1A Q16665 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4882056 0.97 LDHA (0.40) LDHASRRFFAR3HDAC3HDAC1
SCHEMBL9249105 0.85 CYP4F2 (0.32) FFAR3ALDH1A1
SCHEMBL28298064 0.85 LDHA (0.31) LDHASRRMEN1ALDH1A1CYP1A2
SCHEMBL29152698 0.79 GPR84 (0.43) MEN1ALDH1A1KMT2ATSHR
SCHEMBL2467542 0.76 LDHA (0.40) LDHASRRFFAR3HDAC3HDAC1
SCHEMBL28906293 0.75 AKR1B1 (0.41) MEN1ALDH1A1KMT2ATSHRAKR1B1
SCHEMBL1304727 0.74 LDHA (0.38) LDHASRRFFAR3HDAC3HDAC1
SCHEMBL20506735 0.74 CA4 (0.43) FFAR3HDAC3HDAC1HDAC2HDAC8
SCHEMBL10909583 0.74 HMGCR (0.40) LDHASRRFFAR3HDAC3HDAC1
SCHEMBL237875 0.74 CA4 (0.43) FFAR3HDAC3HDAC1HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0582472-B1 Non-magnetic particles TODA KOGYO CORP (JP) 1997-05-28 EP claimed
EP-0129069-B1 PROCESS FOR BONDING NON-POLAR OR HIGHLY CRYSTALLINE RESIN SUBSTRATS TO EACH OTHER OR TO ANOTHER MATERIAL TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-21 EP claimed
CN-116283690-B Compound and polymer with dynamic function formed by same 上海交通大学 2025-03-11 CN disclosed
CN-118043423-A Adhesive composition and laminate comprising same 综研化学株式会社 2024-05-14 CN disclosed
WO-2023119654-A1 NEGATIVE ELECTRODE, SECONDARY BATTERY, AND BATTERY PACK 株式会社 東芝 2023-06-29 WO disclosed
CN-116283690-A Compound and polymer with dynamic function formed by same 上海交通大学 2023-06-23 CN disclosed
WO-2022202173-A1 CURABLE RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2022-09-29 WO disclosed
CN-110249000-B Resin composition, molded body, laminate, gas barrier material, coating material, and adhesive DIC株式会社 2022-07-08 CN disclosed
CN-110291151-B Resin composition, molded body, laminate, coating material, and adhesive DIC株式会社 2022-05-06 CN disclosed
CN-110431186-B Resin composition, molded body, laminate, gas barrier material, coating material, and adhesive DIC株式会社 2022-02-25 CN disclosed
EP-3262110-A1 STORAGE-STABLE IMPREGNATING RESINS AND ELECTRICAL INSULATING TAPES Siemens Aktiengesellschaft (DE) 2018-01-03 EP disclosed
EP-1586295-A1 Cosmetic composition for skin, lips and / or nails. L'OREAL (FR) 2005-10-19 EP disclosed
EP-1586296-A1 Cosmetic composition for application to the skin, lips and/or nails. L'OREAL (FR) 2005-10-19 EP disclosed
EP-1572701-A1 PROCESS FOR THE PRODUCTION OF HYDROCARBYL SILYL CARBOXYLATE COMPOUNDS SIGMA COATINGS B.V. (NL) 2005-09-14 EP disclosed
US-20040187783-A1 Thin film forming apparatus and thin film forming method KONICA MINOLTA HOLDINGS, INC. (JP) 2004-09-30 US disclosed
WO-2004056837-A1 PROCESS FOR THE PRODUCTION OF HYDROCARBYL SILYL CARBOXYLATE COMPOUNDS SIGMA COATINGS B.V. (NL) 2004-07-08 WO disclosed
EP-0859021-A2 Epoxidised compositions DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-08-19 EP disclosed
US-5494977-A A CURABLE EPOXIDIZED POLYESTER, ADDITION POLYMER OR ADDITION-CONDENSATION COPOLYMER FORMED WITH AN ANHYDRIDE STARTING COMPOUND; SOFTENING TEMPERATURE; INKS, COATINGS, VARNISHES DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-02-27 US disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 EP disclosed
US-5110392-A PRIMER COMPOSITION CONTAINING AN ORGANOMETALLIC COMPOUND FOR BINDING SUBSTRATES WITH A CYANOCRYLATE ADHESIVE TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1992-05-05 US disclosed