SCHEMBL996128

SCHEMBL996128

CCCCCC(C)(C)c1ccc(OC(c2c(C(C)(C)C)cc(C)cc2C(C)(C)C)C(CO)(CO)CO)c(C(C)(C)CCCCC)c1

nearest known ligand 0.44

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 20/20 0.44
CNR1 P21554 15/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL996129 0.85 SMN1; SMN2 (0.35) CNR2CNR1
SCHEMBL5016251 0.84 CNR2 (0.42) CNR2CNR1
SCHEMBL997016 0.82 KDM4E (0.33) CNR2CNR1
SCHEMBL674845 0.80 CNR2 (0.38) CNR2CNR1
SCHEMBL10456461 0.79 CNR2 (0.40) CNR2CNR1
SCHEMBL996120 0.79 CNR2 (0.37) CNR2CNR1
SCHEMBL7943884 0.75 THRA (0.39)
SCHEMBL7945365 0.75 THRA (0.39)
SCHEMBL28097663 0.74 CYP3A4 (0.33)
SCHEMBL10487319 0.73 CNR2 (0.46) CNR2CNR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3604447-B1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE ASAHI CHEMICAL IND (JP) 2023-08-16 EP disclosed
US-11192979-B2 Polyamide composition and molded article ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-12-07 US disclosed
US-10815377-B2 Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device part MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2020-10-27 US disclosed
EP-3081598-B1 POLYAMIDE COMPOSITION, MOLDED ARTICLE, REFLECTIVE BOARD FOR LEDS, AND METHOD FOR PREVENTING HEAT-INDUCED REFLECTIVITY REDUCTION ASAHI CHEMICAL IND (JP) 2020-06-10 EP disclosed
US-20200087458-A1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-03-19 US disclosed
EP-3604447-A1 POLYAMIDE COMPOSITION AND MOLDED ARTICLE Asahi Kasei Kabushiki Kaisha (JP) 2020-02-05 EP disclosed
US-20180298190-A1 RESIN COMPOSITION, RESIN MOLDING, METHOD FOR MANUFACTURING PLATED RESIN MOLDING, AND METHOD FOR MANUFACTURING ANTENNA-EQUIPPED PORTABLE ELECTRONIC DEVICE PART MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2018-10-18 US disclosed
US-9611356-B2 Copolymer polyamide ASAHI KASEI CHEMICALS CORPORATION (JP) 2017-04-04 US disclosed
EP-2687555-B1 POLYAMIDE AND POLYAMIDE COMPOSITION ASAHI CHEMICAL IND (JP) 2016-12-14 EP disclosed
US-20160304696-A1 POLYAMIDE COMPOSITION, MOLDED ARTICLE, REFLECTIVE PLATE FOR LED, AND METHOD FOR SUPPRESSING REDUCTION IN REFLECTANCE DUE TO HEAT ASAHI KASEI KABUSHIKI KAISHA (JP) 2016-10-20 US disclosed
US-20140002311-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD OF MANUFACTURING RESIN MOLDED ARTICLE WITH PLATED LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2014-01-02 US disclosed
EP-2676799-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING, AND PROCESS FOR PRODUCING RESIN MOLDING HAVING PLATING LAYER ATTACHED THERETO Mitsubishi Chemical Europe GmbH (DE) 2013-12-25 EP disclosed
EP-2662397-A1 COPOLYMER POLYAMIDE Asahi Kasei Chemicals Corporation (JP) 2013-11-13 EP disclosed
US-20130281655-A1 POLYAMIDE, POLYAMIDE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE ASAHI KASEI CHEMICALS CORP (JP) 2013-10-24 US disclosed
US-20130261256-A1 COPOLYMER POLYAMIDE ASAHI KASEI CHEMICALS CORPORATION (JP) 2013-10-03 US disclosed
US-8487024-B2 Polyamide, polyamide composition, and method for producing polyamide ASAHI KASEI CHEMICALS CORPORATION (JP) 2013-07-16 US disclosed
EP-2476717-A1 POLYAMIDE AND POLYAMIDE COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2012-07-18 EP disclosed
US-20120165466-A1 POLYAMIDE AND POLYAMIDE COMPOSITION ASAHI KASEI CHEMICALS CORPORATION (JP) 2012-06-28 US disclosed
US-20110028614-A1 POLYAMIDE, POLYAMIDE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE ASAHI KASEI CHEMICALS CORPORATION (JP) 2011-02-03 US disclosed
EP-2270067-A1 POLYAMIDE, POLYAMIDE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE Asahi Kasei Chemicals Corporation (JP) 2011-01-05 EP disclosed