⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2616352 | 0.88 | — | — | |
| SCHEMBL10305689 | 0.80 | — | — | |
| SCHEMBL9972950 | 0.80 | — | — | |
| SCHEMBL6935640 | 0.74 | PER2 (0.33) | — | |
| SCHEMBL9008729 | 0.73 | — | — | |
| SCHEMBL10339299 | 0.73 | PIK3CD (0.41) | — | |
| SCHEMBL13897162 | 0.73 | — | — | |
| SCHEMBL27525130 | 0.72 | PER2 (0.33) | — | |
| SCHEMBL9643843 | 0.71 | — | — | |
| SCHEMBL14236557 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9431295-B2 | Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating same | GLOBALFOUNDRIES INC. (KY) | 2016-08-30 | — | — | US | disclosed |
| US-9235124-B2 | Planarization over topography with molecular glass materials | GLOBALFOUNDRIES INC. (KY) | 2016-01-12 | — | — | US | disclosed |
| US-9059249-B2 | Interconnect structures containing a photo-patternable low-k dielectric with a curved sidewall surface | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-06-16 | — | — | US | disclosed |
| US-8952539-B2 | Methods for fabrication of an air gap-containing interconnect structure | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-02-10 | — | — | US | disclosed |
| US-8896120-B2 | Structures and methods for air gap integration | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-11-25 | — | — | US | disclosed |
| US-8795556-B2 | Self-aligned permanent on-chip interconnect structure formed by pitch splitting | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-08-05 | — | — | US | disclosed |
| US-20140131880-A1 | METHODS FOR FABRICATION OF AN AIR GAP-CONTAINING INTERCONNECT STRUCTURE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-05-15 | — | — | US | disclosed |
| US-8642252-B2 | Methods for fabrication of an air gap-containing interconnect structure | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-02-04 | — | — | US | disclosed |
| US-8637395-B2 | Methods for photo-patternable low-k (PPLK) integration with curing after pattern transfer | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-01-28 | — | — | US | disclosed |
| US-8487411-B2 | Multiple patterning using improved patternable low-κ dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-07-16 | — | — | US | disclosed |
| US-20120018891-A1 | METHODS TO FORM SELF-ALIGNED PERMANENT ON-CHIP INTERCONNECT STRUCTURES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-01-26 | — | — | US | disclosed |
| US-20110272810-A1 | STRUCTURE AND METHOD FOR AIR GAP INTERCONNECT INTEGRATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-11-10 | — | — | US | disclosed |
| US-20110260326-A1 | STRUCTURES AND METHODS FOR AIR GAP INTEGRATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-10-27 | — | — | US | disclosed |
| US-20110250544-A1 | BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2011-10-13 | — | — | US | disclosed |
| US-20110221062-A1 | METHODS FOR FABRICATION OF AN AIR GAP-CONTAINING INTERCONNECT STRUCTURE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-09-15 | — | — | US | disclosed |
| US-20110115090-A1 | INTERCONNECT STRUCTURE INCLUDING A MODIFIED PHOTORESIST AS A PERMANENT INTERCONNECT DIELECTRIC AND METHOD OF FABRICATING SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-05-19 | — | — | US | disclosed |
| US-20110115094-A1 | STRUCTURES AND METHODS FOR PHOTO-PATTERNABLE LOW-k (PPLK) INTEGRATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-05-19 | — | — | US | disclosed |
| US-20110079579-A1 | PLANARIZATION OVER TOPOGRAPHY WITH MOLECULAR GLASS MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-04-07 | — | — | US | disclosed |
| US-20110074044-A1 | PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-03-31 | — | — | US | disclosed |
| WO-2009022224-A2 | ANTIREFLECTIVE COATING COMPOSITION | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-02-19 | — | — | WO | disclosed |