SCHEMBL998786

SCHEMBL998786

[CH2]CC(C)OCC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8628983 0.83 ALDH1A1 (0.38)
SCHEMBL15239294 0.83 EPHX1 (0.31)
SCHEMBL6303425 0.82 ALDH1A1 (0.43)
SCHEMBL6310703 0.82 ALDH1A1 (0.43)
SCHEMBL17644166 0.80 ALDH1A1 (0.37)
SCHEMBL93383 0.80
SCHEMBL9918912 0.80 ALDH1A1 (0.41)
SCHEMBL18095076 0.78 ALDH1A1 (0.40)
SCHEMBL1186550 0.78 TSHR (0.42)
SCHEMBL16038406 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8734708-B2 Polar polydimethysiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer DOW CORNING CORPORATION (US) 2014-05-27 US claimed
CN-101495533-B Epoxy resin composition, cured product thereof, novel epoxy resin, method for producing same, and novel phenol resin DAINIPPON INK & CHEMICALS 2012-02-29 CN claimed
JP-2011502194-A 2011-01-20 JP claimed
US-20100206470-A1 Polar Polydimethysiloxane Molds, Methods of Making the Molds, and Methods of Using the Molds for Pattern Transfer DOW CORNING CORPORATION 2010-08-19 US claimed
EP-2206015-A2 POLAR POLYDIMETHYLSILOXANE MOLDS, METHODS OF MAKING THE MOLDS, AND METHODS OF USING THE MOLDS FOR PATTERN TRANSFER Dow Corning Corporation (US) 2010-07-14 EP claimed
CN-101495533-A Epoxy resin composition, cured product thereof, novel epoxy resin, method for producing same, and novel phenol resin DAINIPPON INK & CHEMICALS (JP) 2009-07-29 CN claimed
CN-101389683-A Epoxy resin composition, hardening product thereof, novel epoxy resin, novel phenolic resin and semiconductor sealing material DAINIPPON INK & CHEMICALS (JP) 2009-03-18 CN claimed
WO-2009021249-A2 POLAR POLYDIMETHYLSILOXANE MOLDS, METHODS OF MAKING THE MOLDS, AND METHODS OF USING THE MOLDS FOR PATTERN TRANSFER DOW CORNING CORPORATION (US) 2009-02-12 WO claimed
EP-0767179-B1 Method for producing a rubber composition BRIDGESTONE CORP (JP) 2001-06-27 EP claimed
US-6117927-A MODIFYING TERMINAL OF A DIENE RUBBER WITH A SILANE MODIFIER HAVING A SPECIFIC FUNCTIONALITY, BRIDGESTONE CORPORATION (JP) 2000-09-12 US claimed
EP-0767179-A2 Method for producing a rubber composition Bridgestone Corporation (JP) 1997-04-09 EP claimed
US-11939496-B2 Curable adhesive composition for multi-purpose bonding applications HENKEL AG & CO. KGAA (DE) 2024-03-26 US disclosed
US-20240092043-A1 CONTACT LENS WITH A HYDROGEL COATING THEREON ALCON INC. (CH) 2024-03-21 US disclosed
CN-117597233-A Laminate, laminate for outdoor use, and hard coating layer forming material 迪睿合株式会社 2024-02-23 CN disclosed
WO-2024038390-A1 A CONTACT LENS WITH A HYDROGEL COATING THEREON ALCON INC. (CH) 2024-02-22 WO disclosed
CN-1178230-A Epoxy resin liquid composition for semiconductor encapsulation NIPPON KAYAKU KK (JP) 1998-04-08 CN disclosed
US-5668204-A MOLDING MATERIALS, AGING RESISTANCE OF POLYCARBONTESILOXANES BAYER AKTIENGESELLSCHAFT (DE) 1997-09-16 US disclosed
EP-0505869-B1 Stabilization of high-temperature deformation resistant polycarbonate BAYER AG (DE) 1997-09-10 EP disclosed
US-5623026-A STABLE, AGING RESISTANT NONHYDROLYZING BLENDS BAYER AKTIENGESELLSCHAFT (DE) 1997-04-22 US disclosed
EP-0691364-A2 Epoxy group containing siloxanes and their mixtures with polycarbonates BAYER AG (DE) 1996-01-10 EP disclosed