SCHEMBL9999618

SCHEMBL9999618

Cc1ccc(C(=O)c2ccc(C)c(C)c2C)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.58
LMNA P02545 3/20 0.58
AKR1C3 P42330 1/20 0.52
SRD5A2 P31213 2/20 0.50
CES2 O00748 1/20 0.46
CES1 P23141 1/20 0.46
MAPT P10636 4/20 0.46
GAA P10253 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
SMN1; SMN2 Q16637 3/20 0.45
TDP1 Q9NUW8 2/20 0.44
COMT P21964 1/20 0.43
HTT P42858 3/20 0.42
PKM P14618 2/20 0.42
ATM Q13315 2/20 0.42
NPSR1 Q6W5P4 2/20 0.42
HPGD P15428 1/20 0.42
NLRP1 Q9C000 1/20 0.42
MEN1 O00255 1/20 0.42
NTSR1 P30989 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11947075 0.92 ALDH1A1 (0.68) ALDH1A1LMNAAKR1C3SRD5A2CES2
SCHEMBL28432848 0.85 ALDH1A1 (0.52) ALDH1A1LMNAAKR1C3SRD5A2CES2
SCHEMBL12792099 0.84 AKR1C3 (0.67) ALDH1A1LMNAAKR1C3SRD5A2CES2
SCHEMBL109891 0.84 ALDH1A1 (0.50) ALDH1A1LMNAAKR1C3SRD5A2CES2
SCHEMBL30007458 0.84 ALDH1A1 (0.50) ALDH1A1LMNAAKR1C3SRD5A2CES2
SCHEMBL22580864 0.83 SMN1; SMN2 (0.62) ALDH1A1LMNACES2CES1MAPT
SCHEMBL28946122 0.83 SRD5A2 (0.51) ALDH1A1SRD5A2MAPTSMN1; SMN2TDP1
SCHEMBL8732527 0.83 TDP2 (0.36) ALDH1A1LMNAAKR1C3MAPTGAA
SCHEMBL11658935 0.82 NFE2L2 (0.42) ALDH1A1LMNASMN1; SMN2TDP1HTT
SCHEMBL11613229 0.82 AKR1C3 (0.59) ALDH1A1LMNAAKR1C3SRD5A2CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8309280-B2 Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2012-11-13 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-8119833-B2 Dendrimer solid acid and polymer electrolyte membrane including the same SAMSUNG SDI CO., LTD. (KR) 2012-02-21 US disclosed
US-8119833-B2 Dendrimer solid acid and polymer electrolyte membrane including the same SAMSUNG SDI CO., LTD. (KR) 2012-02-21 US disclosed
US-8049033-B2 Dendrimer solid acid and polymer electrolyte membrane including the same SAMSUNG SDI CO., LTD. (KR) 2011-11-01 US disclosed
US-8049033-B2 Dendrimer solid acid and polymer electrolyte membrane including the same SAMSUNG SDI CO., LTD. (KR) 2011-11-01 US disclosed
US-20110262833-A1 DENDRIMER SOLID ACID AND POLYMER ELECTROLYTE MEMBRANE INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2011-10-27 US disclosed
US-20110262833-A1 DENDRIMER SOLID ACID AND POLYMER ELECTROLYTE MEMBRANE INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2011-10-27 US disclosed
US-7858721-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2010-12-28 US disclosed
US-7812194-B2 Positive photosensitive composition FUJIFILM CORPORATION (JP) 2010-10-12 US disclosed
US-7439005-B2 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2008-10-21 US disclosed
US-7435526-B2 Positive photosensitive composition FUJIFILM CORPORATION (JP) 2008-10-14 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-7344821-B2 Positive resist composition for use with electron beam, EUV light or X ray, and pattern formation method using the same FUJIFILM CORPORATION (JP) 2008-03-18 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed
US-20070134586-A1 Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern NEC CORPORATION (JP) 2007-06-14 US disclosed
US-20070092779-A1 Dendrimer solid acid and polymer electrolyte membrane including the same SAMSUNG SDI CO., LTD. (KR) 2007-04-26 US disclosed
US-20070092779-A1 Dendrimer solid acid and polymer electrolyte membrane including the same SAMSUNG SDI CO., LTD. (KR) 2007-04-26 US disclosed
US-20070003871-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2007-01-04 US disclosed