Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethane SCHEMBL18094355 | 0.83 | CA2 (0.33) | — | |
| SCHEMBL332145 | 0.83 | CA1 (0.35) | — | |
| SCHEMBL30175213 | 0.79 | CA1 (0.33) | — | |
| SCHEMBL95102 | 0.79 | LMNA (0.40) | LMNA | |
| SCHEMBL6855074 | 0.76 | CA1 (0.32) | — | |
| SCHEMBL5109593 | 0.75 | LMNA (0.38) | LMNA | |
| Calcium SCHEMBL5082390 | 0.75 | LMNA (0.38) | LMNA | |
| SCHEMBL4947446 | 0.75 | CA1 (0.33) | — | |
| SCHEMBL1005276 | 0.75 | LMNA (0.42) | LMNA | |
| SCHEMBL5109742 | 0.75 | GABRA1 (0.32) | LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8097545-B2 | Improved processability, dielectric properties, heat resistance, and adhesiveness; prepregs; laminates; surface treatment | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-17 | — | — | US | disclosed |
| US-20110224332-A1 | THERMOSETTING RESIN COMPOSITION AND USE THEREOF | ITEQ CORPORATION (TW) | 2011-09-15 | — | — | US | disclosed |
| US-20100240811-A1 | Thermosetting Resin Composition and Application Thereof | ITEQ (DONGGUAN) CORPORATION (CN) | 2010-09-23 | — | — | US | disclosed |
| US-7629402-B2 | Acrylonitrile-butadiene-styrene resin composition having good weatherability and thermostability | LG CHEM, LTD. (KR) | 2009-12-08 | — | — | US | disclosed |
| US-20080090478-A1 | Phase-Separation-Controlled Polybutadiene Resin Composition and Printed Wiring Board Using the Resin Composition | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-04-17 | — | — | US | disclosed |