SCHEMBL10015809

SCHEMBL10015809

CO[Si](CCCn1c(=O)n(C)c(=O)n(CCC[Si](OC)(OC)OC)c1=O)(OC)OC

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PDE4A P27815 5/20 0.33
PDE4B Q07343 5/20 0.33
PDE4C Q08493 5/20 0.33
PDE4D Q08499 5/20 0.33
ADORA2A P29274 4/20 0.33
PDE5A O76074 1/20 0.31
ADORA2B P29275 3/20 0.31
TRPC5 Q9UL62 1/20 0.31
LMNA P02545 1/20 0.31
GRM2 Q14416 1/20 0.30
TNF P01375 1/20 0.30
GAA P10253 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22021018 0.96 HTT (0.32) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL155052 0.94 LMNA (0.33) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL12892325 0.90 PDE4A (0.33) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL3402639 0.88 LMNA (0.32) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL12164889 0.87 RGS4 (0.42) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL9891728 0.87 RGS4 (0.42) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL3400000 0.86 LMNA (0.35) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL3405710 0.86 LMNA (0.35) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL3402332 0.86 LMNA (0.35) PDE4APDE4BPDE4CPDE4DADORA2A
SCHEMBL14865773 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180057638-A1 SILICONE RESIN SUBSTRATE, METAL LAYER-FORMED SILICONE RESIN SUBSTRATE, CURED SILICONE RESIN SUBSTRATE, AND METAL LAYER-FORMED CURED-SILICONE RESIN SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-01 US disclosed
US-20180057648-A1 SILICONE RESIN TRANSPARENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-01 US disclosed
US-9657175-B2 Silicone resin composition for sealing optical semiconductor element and optical semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-23 US disclosed
US-20160322293-A1 PRINTED WIRING BOARD, METHOD FOR PRODUCING PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-11-03 US disclosed
US-9403967-B2 Curable resin composition, cured product thereof and photosemiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-02 US disclosed
US-20160108240-A1 SILICONE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-21 US disclosed
US-9163144-B2 Silicone resin composition, silicone laminated substrate using the same, method for producing the same, and LED device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-10-20 US disclosed
US-20150245476-A1 SUBSTRATE AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-08-27 US disclosed
US-20140120793-A1 SILICONE RESIN COMPOSITION, SILICONE LAMINATED SUBSTRATE USING THE SAME, METHOD FOR PRODUCING THE SAME, AND LED DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-05-01 US disclosed
US-20120261068-A1 CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPAQUE SILICONE ADHESIVE SHEET FORMED FROM THE COMPOSITION KASHIWAGI TSUTOMU (JP) 2012-10-18 US disclosed
US-8119759-B2 Swellable sol-gels, methods of making, and use thereof AQUANEX TECHNOLOGIES, LLC 2012-02-21 US disclosed
US-20100254856-A1 SWELLABLE SOL-GELS, METHODS OF MAKING, AND USE THEREOF WOOTECH, LTD. 2010-10-07 US disclosed