SCHEMBL1003516

SCHEMBL1003516

C(OCC1CO1)C1CO1.CCCCCCCCCCc1ccccc1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.49
ALDH1A1 P00352 1/20 0.49
BID P55957 3/20 0.45
MCL1 Q07820 3/20 0.45
BCL2L1 Q07817 2/20 0.45
BAK1 Q16611 2/20 0.45
KAT8 Q9H7Z6 2/20 0.45
PPARG P37231 1/20 0.45
PPARA Q07869 1/20 0.45
EP300 Q09472 1/20 0.45
KAT2A Q92830 1/20 0.45
KAT2B Q92831 1/20 0.45
KAT5 Q92993 1/20 0.45
SAE1 Q9UBE0 1/20 0.45
LIPG Q9Y5X9 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
ALOX5 P09917 2/20 0.43
TSHR P16473 2/20 0.43
MEN1 O00255 1/20 0.43
TP53 P04637 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL413662 1.00 TDP1 (0.49) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL29256323 1.00 TDP1 (0.49) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL21552431 1.00 TDP1 (0.49) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL9350609 1.00 TDP1 (0.49) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL8750967 1.00 TDP1 (0.49) TDP1ALDH1A1BIDMCL1BCL2L1
Ethylene Glycol SCHEMBL11518185 0.96 TDP1 (0.46) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL2123587 0.94 SMN1; SMN2 (0.46) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL7870185 0.89 ALDH1A1 (0.48) TDP1ALDH1A1BIDMCL1BCL2L1
SCHEMBL28041231 0.89 HTR1A (0.44) TDP1ALDH1A1SMN1; SMN2TSHRMEN1
SCHEMBL7780907 0.88 F7 (0.46) TDP1ALDH1A1BIDMCL1BCL2L1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8759457-B2 Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same DOW GLOBAL TECHNOLOGIES, LLC (US) 2014-06-24 US disclosed
CN-101983217-B Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same DOW GLOBAL TECHNOLOGIES INC 2013-10-09 CN disclosed
CN-101983217-A Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same DOW GLOBAL TECHNOLOGIES INC 2011-03-02 CN disclosed
US-20110020555-A1 EPOXY RESIN COMPOSITIONS HAVING IMPROVED LOW TEMPERATURE CURE PROPERTIES AND PROCESSES AND INTERMEDIATES FOR MAKING THE SAME BLUE CUBE IP LLC 2011-01-27 US disclosed
EP-2265657-A2 EPOXY RESIN COMPOSITIONS HAVING IMPROVED LOW TEMPERATURE CURE PROPERTIES AND PROCESSES AND INTERMEDIATES FOR MAKING THE SAME Dow Global Technologies Inc. (US) 2010-12-29 EP disclosed
WO-2009126393-A2 EPOXY RESIN COMPOSITIONS HAVING IMPROVED LOW TEMPERATURE CURE PROPERTIES AND PROCESSES AND INTERMEDIATES FOR MAKING THE SAME DOW GLOBAL TECHNOLOGIES INC. (US) 2009-10-15 WO disclosed