SCHEMBL10060650

SCHEMBL10060650

C=CC(=O)SCCOCCOCCSC(=O)C=C

nearest known ligand 0.46

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.46
ALDH1A1 P00352 3/20 0.46
TP53 P04637 2/20 0.46
HIF1A Q16665 2/20 0.46
HSD17B10 Q99714 1/20 0.46
CYP3A4 P08684 1/20 0.32
THRB P10828 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL711455 0.98 TSHR (0.43) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL13636831 0.82 THRB (0.39) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL4860614 0.80 LMNA (0.37) TSHRALDH1A1
SCHEMBL3742820 0.73
SCHEMBL5081197 0.73 LMNA (0.32) TSHRALDH1A1HSD17B10
SCHEMBL4860659 0.73 LMNA (0.32) TSHRALDH1A1HSD17B10
SCHEMBL10358045 0.73
SCHEMBL10358044 0.73
SCHEMBL5081721 0.73 LMNA (0.32) TSHRALDH1A1HSD17B10
Ethylene Glycol SCHEMBL6856682 0.73 TSHR (0.36) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2085220-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORP (JP) 2015-05-20 EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
EP-2106906-B1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-08-14 EP disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
EP-2085220-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM Corporation (JP) 2009-08-05 EP disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
EP-2082874-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving Fujifilm Corporation (JP) 2009-07-29 EP disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed