SCHEMBL10060665

SCHEMBL10060665

C=CCNC(=S)OCCOC(=O)C(=C)C

nearest known ligand 0.46

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.46
TSHR P16473 5/20 0.41
ALDH1A1 P00352 3/20 0.36
SMN1; SMN2 Q16637 1/20 0.34
MAPT P10636 1/20 0.34
CA1 P00915 2/20 0.34
CA2 P00918 1/20 0.34
GAA P10253 3/20 0.33
HTT P42858 2/20 0.33
LMNA P02545 1/20 0.33
CA9 Q16790 1/20 0.33
POLB P06746 1/20 0.33
APEX1 P27695 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
PKM P14618 1/20 0.33
FAAH O00519 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12693909 0.83 ALDH1A1 (0.38) TSHRALDH1A1MAPTGAAPOLB
SCHEMBL23031291 0.83 THRB (0.49) THRBTSHRALDH1A1SMN1; SMN2MAPT
SCHEMBL23031233 0.77 THRB (0.42) THRBTSHRALDH1A1SMN1; SMN2MAPT
SCHEMBL23031387 0.77 TSHR (0.46) THRBTSHRSMN1; SMN2MAPTHTT
SCHEMBL13795243 0.77 THRB (0.36) THRBTSHRALDH1A1SMN1; SMN2CA1
SCHEMBL10885725 0.75 HPGD (0.44) TSHRALDH1A1SMN1; SMN2MAPTGAA
SCHEMBL22525496 0.75 THRB (0.51) THRBTSHRALDH1A1SMN1; SMN2MAPT
SCHEMBL5187340 0.75 THRB (0.64) THRBTSHRALDH1A1CA1CA2
SCHEMBL278238 0.75 THRB (0.46) THRBTSHRALDH1A1SMN1; SMN2GAA
Propene SCHEMBL672400 0.74 THRB (0.63) THRBTSHRALDH1A1CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2085220-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORP (JP) 2015-05-20 EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
EP-2106906-B1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-08-14 EP disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 US disclosed
US-20090220753-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-09-03 US disclosed
EP-2085220-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM Corporation (JP) 2009-08-05 EP disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090123712-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed
US-20090081414-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-03-26 US disclosed