SCHEMBL10074002

SCHEMBL10074002

CC1(C)CC(N2C(=O)C=CC2=O)CC(C)(CN2C(=O)C=CC2=O)C1

nearest known ligand 0.32

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
GMNN O75496 1/20 0.32
ALDH1A1 P00352 1/20 0.32
LMNA P02545 1/20 0.32
MAPT P10636 1/20 0.32
THPO P40225 1/20 0.32
BLM P54132 1/20 0.32
PMP22 Q01453 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
MGLL Q99685 1/20 0.32
CNR2 P34972 6/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18507409 0.84 CNR2 (0.35) GMNNALDH1A1LMNAMAPTTHPO
SCHEMBL30209535 0.80 GMNN (0.33) GMNNALDH1A1LMNAMAPTTHPO
SCHEMBL17532455 0.77 MEN1 (0.31) CNR2
SCHEMBL21357682 0.76 CNR2 (0.32) CNR2
SCHEMBL24541445 0.75 CNR2 (0.31) ALDH1A1CNR2
SCHEMBL9625632 0.74 ALDH1A1 (0.46) ALDH1A1LMNAMAPTNPSR1
SCHEMBL29489397 0.74 MGLL (0.36) GMNNALDH1A1LMNAMAPTTHPO
SCHEMBL17532452 0.72 ALDH1A1 (0.34) ALDH1A1
SCHEMBL26077419 0.72 PARG (0.31) CNR2
SCHEMBL21162508 0.72 HSD11B1 (0.30) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025238104-A1 RESIN COMPOSITION FOR A RADIATION-CURING ADDITIVE MANUFACTURING PROCESS, PARTICULARLY FOR A LITHOGRAPHIC MANUFACTURING PROCESS ALIGN TECHNOLOGY, INC. (US) 2025-11-20 WO disclosed
WO-2022132359-A1 CURABLE COMPOSITION FOR MAKING CURED LAYER WITH HIGH THERMAL STABILITY CANON KABUSHIKI KAISHA (JP) 2022-06-23 WO disclosed
US-20220185915-A1 CURABLE COMPOSITION FOR MAKING CURED LAYER WITH HIGH THERMAL STABILITY CANON KABUSHIKI KAISHA (JP) 2022-06-16 US disclosed
CN-114369401-A Resin composition, cured product, sheet-like laminate, resin sheet, printed wiring board, and semiconductor device 味之素株式会社 2022-04-19 CN disclosed
CN-113667302-A Resin composition 味之素株式会社 2021-11-19 CN disclosed
CN-113667270-A Resin composition 味之素株式会社 2021-11-19 CN disclosed
CN-113637288-A Resin composition 味之素株式会社 2021-11-12 CN disclosed
US-20120049106-A1 MALEIMIDE-FUNCTIONAL MONOMERS IN AMORPHOUS FORM DESIGNER MOLECULES, INC. (US) 2012-03-01 US disclosed
US-20120049106-A1 MALEIMIDE-FUNCTIONAL MONOMERS IN AMORPHOUS FORM DESIGNER MOLECULES, INC. (US) 2012-03-01 US disclosed