SCHEMBL10085282

SCHEMBL10085282

CO/N=C(\C#N)c1ccc(C(C)=O)cc1

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 5/20 0.42
▸ ALDH1A1 P00352 1/20 0.42
▸ RAB9A P51151 3/20 0.42
▸ HPGD P15428 2/20 0.42
▸ NOS3 P29474 2/20 0.39
▸ NOS1 P29475 2/20 0.39
▸ L3MBTL1 Q9Y468 2/20 0.38
▸ LMNA P02545 1/20 0.38
▸ KMT2A Q03164 1/20 0.38
▸ SMN1; SMN2 Q16637 2/20 0.38
▸ NPC1 O15118 2/20 0.38
▸ MAPK1 P28482 1/20 0.38
▸ STAT3 P40763 1/20 0.38
▸ STAT1 P42224 1/20 0.38
▸ TDP1 Q9NUW8 1/20 0.38
▸ PLA2G7 Q13093 1/20 0.38
▸ PGR P06401 1/20 0.37
▸ HSD17B1 P14061 1/20 0.37
▸ GAA P10253 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8442853 0.80 SMN1; SMN2 (0.41) MAPTALDH1A1RAB9AL3MBTL1LMNA
SCHEMBL23504933 0.80 NPSR1 (0.50) MAPTALDH1A1RAB9AHPGDL3MBTL1
SCHEMBL1344772 0.80 NPSR1 (0.50) MAPTALDH1A1RAB9AHPGDL3MBTL1
SCHEMBL1344768 0.80 NPSR1 (0.50) MAPTALDH1A1RAB9AHPGDL3MBTL1
SCHEMBL8848886 0.79 PLA2G7 (0.47) MAPTALDH1A1RAB9AHPGDL3MBTL1
SCHEMBL8441573 0.79 PLA2G7 (0.47) MAPTALDH1A1RAB9AHPGDL3MBTL1
SCHEMBL8443255 0.77 MAPT (0.40) MAPTALDH1A1RAB9ALMNAKMT2A
SCHEMBL11252091 0.76 SMN1; SMN2 (0.41) MAPTALDH1A1RAB9AHPGDLMNA
SCHEMBL11252094 0.76 SMN1; SMN2 (0.41) MAPTALDH1A1RAB9AHPGDLMNA
SCHEMBL12760555 0.74 MAPT (0.45) MAPTALDH1A1RAB9AHPGDL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2305754-B1 Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film SHINETSU CHEMICAL CO (JP) 2012-01-25 — — EP disclosed
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