Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 4/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.46 |
| ▸ | MAPT | P10636 | 4/20 | 0.46 |
| ▸ | RAB9A | P51151 | 3/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | PKM | P14618 | 1/20 | 0.46 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.43 |
| ▸ | ADORA1 | P30542 | 2/20 | 0.43 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.42 |
| ▸ | HPGD | P15428 | 2/20 | 0.42 |
| ▸ | PDGFRB | P09619 | 2/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.40 |
| ▸ | TP53 | P04637 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL1307189 | 0.98 | MEN1 (0.44) | MEN1KMT2AMAPTRAB9AKDM4E | |
| Bromide SCHEMBL28138957 | 0.98 | KMT2A (0.44) | MEN1KMT2AMAPTRAB9AKDM4E | |
| SCHEMBL3669956 | 0.96 | MEN1 (0.43) | MEN1KMT2AMAPTRAB9AKDM4E | |
| SCHEMBL13963161 | 0.88 | MAPT (0.41) | MEN1KMT2AMAPTRAB9AKDM4E | |
| SCHEMBL28136880 | 0.88 | TP53 (0.41) | MEN1KMT2AMAPTRAB9AKDM4E | |
| Nitric Acid SCHEMBL28186561 | 0.88 | ALDH1A1 (0.43) | MEN1KMT2AMAPTRAB9AKDM4E | |
| SCHEMBL17983446 | 0.86 | ENPP3 (0.36) | MEN1KMT2AMAPTRAB9AKDM4E | |
| Trifluoroacetic Acid SCHEMBL28186548 | 0.85 | CHRNA7 (0.42) | MEN1KMT2AMAPTRAB9AKDM4E | |
| SCHEMBL18770391 | 0.84 | ADORA3 (0.42) | MEN1KMT2AMAPTRAB9AKDM4E | |
| SCHEMBL8932214 | 0.84 | NPC1 (0.49) | RAB9ATSHRNPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 363 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117143315-B | Composition containing polyalkenyl and used for DCPD epoxy resin and copper-clad plate and preparation method thereof | JIANGSU DONGCAI NEW MATERIALS Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| CN-117143315-A | Composition containing polyalkenyl and used for DCPD epoxy resin and copper-clad plate and preparation method thereof | 江苏东材新材料有限责任公司 | 2023-12-01 | — | — | CN | claimed |
| CN-113980370-B | High-hardness high-peel strength yellowing-resistant hydrocarbon resin composition and preparation method and application thereof | 四川东材科技集团股份有限公司 | 2023-08-11 | — | — | CN | claimed |
| CN-112135427-B | Circuit board for power battery | 珠海市浩东电子科技有限公司 | 2022-08-12 | — | — | CN | claimed |
| CN-110183817-B | High-heat-resistance high-toughness low-dielectric fluorenyl benzoxazine resin composition and preparation method and application thereof | 四川东材科技集团股份有限公司 | 2022-04-05 | — | — | CN | claimed |
| CN-114211834-A | Copper-clad plate | 江西生益科技有限公司 | 2022-03-22 | — | — | CN | claimed |
| CN-111072979-B | Modified hydrocarbon resin prepolymer, copper-clad plate and preparation method thereof | 四川东材科技集团股份有限公司 | 2022-03-08 | — | — | CN | claimed |
| CN-113980370-A | High-hardness, high-peel-strength and yellowing-resistant hydrocarbon resin composition as well as preparation method and application thereof | 四川东材科技集团股份有限公司 | 2022-01-28 | — | — | CN | claimed |
| CN-111072980-B | Modified hydrocarbon resin prepolymer, modified hydrocarbon-DCPD epoxy composite material copper-clad plate and preparation method | 四川东材科技集团股份有限公司 | 2021-11-23 | — | — | CN | claimed |
| CN-112710534-A | Copper foil and characterization method thereof, and copper-clad plate | 江西生益科技有限公司 | 2021-04-27 | — | — | CN | claimed |
| EP-2723793-A1 | EPOXY RESIN COMPOSITIONS | Air Products and Chemicals, Inc. (US) | 2014-04-30 | — | — | EP | claimed |
| WO-2012174989-A1 | EPOXY RESIN COMPOSITIONS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-12-27 | — | — | WO | claimed |
| CN-101962466-B | Intrinsic flame-retardant epoxy resin composition for semiconductor package | JIANGSU SINOPACO NEW MATERIAL CO LTD | 2012-01-04 | — | — | CN | claimed |
| CN-102093672-A | Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate | Guangzhou meijia weihua electronic material co ltd | 2011-06-15 | — | — | CN | claimed |
| CN-101974206-A | Epoxy resin composition | JIANGSU ZHONGPENG NEW MATERIAL CO LTD | 2011-02-16 | — | — | CN | claimed |
| CN-101967266-A | Halogen-free fire-retarding epoxy resin composition | JIANGSU ZHONGPENG ADVANCED MATERIALS CO LTD | 2011-02-09 | — | — | CN | claimed |
| CN-101962466-A | Intrinsic flame-retardant epoxy resin composition for semiconductor package | JIANGSU SINOPACO NEW MATERIAL CO LTD | 2011-02-02 | — | — | CN | claimed |
| CN-101831137-A | Epoxy resin composition for packaging semiconductors | JIANGSU ZHONGPENG ELECTRONICS CO LTD | 2010-09-15 | — | — | CN | claimed |
| CN-101759960-A | Epoxy resin composition | GUIYING ZHANG | 2010-06-30 | — | — | CN | claimed |
| EP-0880522-B1 | 5H,10H-IMIDAZO[1,2-a]INDENO[1,2-e]PYRAZINE-4-ONE DERIVATIVES AMPA AND NMDA RECEPTORS ANTAGONISTS, PREPARATION THEREOF, INTERMEDIATES THEREOF AND DRUGS CONTAINING SAME | AVENTIS PHARMA SA (FR) | 2001-09-19 | — | — | EP | claimed |