SCHEMBL10127306

SCHEMBL10127306

CCC(C)(C)C(=O)OC(C)(C)C(=O)O

nearest known ligand 0.35

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
RIPK1 Q13546 4/20 0.34
PPARA Q07869 4/20 0.32
PPARG P37231 2/20 0.32
TSHR P16473 2/20 0.32
ALDH1A1 P00352 1/20 0.32
CYP2D6 P10635 2/20 0.31
CYP2C19 P33261 2/20 0.31
HIF1A Q16665 1/20 0.31
MEN1 O00255 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP3A4 P08684 1/20 0.31
MAPT P10636 1/20 0.31
KMT2A Q03164 1/20 0.31
TET2 Q6N021 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24532122 0.83 ELANE (0.42) PPARAPPARGALDH1A1MEN1KMT2A
SCHEMBL47393 0.81 ALDH1A1 (0.38) TSHRALDH1A1
SCHEMBL16866388 0.80 DGAT1 (0.40) RIPK1ALDH1A1KMT2A
SCHEMBL9064823 0.80 TSHR (0.36) PPARAPPARGTSHRALDH1A1CYP2D6
SCHEMBL25800691 0.78 GAA (0.30)
SCHEMBL47394 0.78 DGAT1 (0.46) RIPK1ALDH1A1MEN1KMT2A
SCHEMBL2740758 0.76 CYP4F2 (0.31)
SCHEMBL15033904 0.76 CYP4F2 (0.31)
SCHEMBL132096 0.76 CYP1A2 (0.33) CYP2D6CYP2C19CYP1A2
SCHEMBL23293010 0.75 TSHR (0.38) PPARAPPARGTSHRALDH1A1CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230002530-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, METHOD FOR FORMING MULTILAYER COATING FILM, ESTER COMPOUND, AND POLYMER KYOEISHA CHEMICAL CO., LTD. (JP) 2023-01-05 US disclosed
US-8252508-B2 Positive photosensitive composition and method of forming resist pattern FUJIFILM CORPORATION (JP) 2012-08-28 US disclosed
US-8206886-B2 Photosensitive composition and pattern-forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2012-06-26 US disclosed
US-8039200-B2 Photosensitive composition and pattern-forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2011-10-18 US disclosed
US-7867697-B2 Positive photosensitive composition and method of forming resist pattern FUJIFILM CORPORATION (JP) 2011-01-11 US disclosed
US-20100304300-A1 PHOTOSENSITIVE COMPOSITION AND PATTERN-FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2010-12-02 US disclosed
US-20100261117-A1 POSITIVE PHOTOSENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN FUJIFILM CORPORATION (JP) 2010-10-14 US disclosed
US-7449573-B2 Photosensitive composition, compound for use in the photosensitive composition, and method of pattern formation with the photosensitive composition FUJIFILM CORPORATION (JP) 2008-11-11 US disclosed
US-7323286-B2 Photosensitive composition, compound used in the same, and patterning method using the same FUJIFILM CORPORATION (JP) 2008-01-29 US disclosed