SCHEMBL1024642

SCHEMBL1024642

CCC=Cc1ccccc1-c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
BACE1 P56817 1/20 0.43
CYP2A6 P11509 1/20 0.40
GRIN2D O15399 2/20 0.40
GRIN3B O60391 2/20 0.40
GRIN1 Q05586 2/20 0.40
GRIN2A Q12879 2/20 0.40
GRIN2B Q13224 2/20 0.40
GRIN2C Q14957 2/20 0.40
GRIN3A Q8TCU5 2/20 0.40
CHRM1 P11229 1/20 0.38
CHRM3 P20309 1/20 0.38
DPP4 P27487 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1471407 1.00 BACE1 (0.43) BACE1CYP2A6GRIN2DGRIN3BGRIN1
SCHEMBL29287250 0.85 NOTUM (0.38) BACE1
SCHEMBL1469236 0.85 TLR8 (0.43) BACE1CYP2A6GRIN2DGRIN3BGRIN1
SCHEMBL1469238 0.85 TLR8 (0.43) BACE1CYP2A6GRIN2DGRIN3BGRIN1
SCHEMBL1983255 0.84 RXRA (0.42) BACE1
SCHEMBL1469737 0.82 PDE5A (0.41) BACE1
SCHEMBL1469736 0.82 PDE5A (0.41) BACE1
SCHEMBL11194587 0.82 BACE1 (0.47) BACE1CYP2A6GRIN2DGRIN3BGRIN1
SCHEMBL11194585 0.82 BACE1 (0.47) BACE1CYP2A6GRIN2DGRIN3BGRIN1
SCHEMBL1864858 0.81 GRIN2D (0.43) BACE1CYP2A6GRIN2DGRIN3BGRIN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 202 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9151140-A None JP disclosed
US-20260138110-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY WATANABE MASASHI (JP) 2026-05-21 US disclosed
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-04-09 US disclosed
EP-4722290-A1 FLUORORUBBER COMPOSITION AND CROSSLINKED MOLDED OBJECT FORMED THEREFROM Zeon Corporation (JP) 2026-04-08 EP disclosed
EP-4714536-A2 HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY Zeon Corporation (JP) 2026-03-25 EP disclosed
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-03-19 US disclosed
US-20260078240-A1 HOLLOW PARTICLES, RESIN COMPOSITION AND MOLDED BODY ZEON CORPORATION (JP) 2026-03-19 US disclosed
US-20260047004-A1 METHOD FOR PRODUCING METAL FOIL-CLAD LAMINATE, RESIN COMPOSITION, RESIN COMPOSITE SHEET, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2026-02-12 US disclosed
EP-4674915-A1 RESIN COMPOSITION, PREPREG, AND MOLDED OBJECT Zeon Corporation (JP) 2026-01-07 EP disclosed
US-20250320348-A1 HOLLOW PARTICLE-CONTAINING ELASTOMER COMPOSITION AND METHOD FOR PRODUCTION THEREOF ZEON CORPORATION (JP) 2025-10-16 US disclosed
US-7595362-B2 Curable resin composition NIPPON STEEL CHEMICAL CO., LTD. (JP) 2009-09-29 US disclosed
US-20090130568-A1 Photosensitive Resin Composition for Volume Phase Hologram Recording and Optical Information Recording Medium Using the Same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2009-05-21 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070219319-A1 Copolymer, Graft Copolymer, Graft Copolymer Particles, Flame Retardant, and Resin Composition KANEKA CORPORATION 2007-09-20 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-20070129502-A1 Polyphenylene ethers; improved chemical resistance, dielectric, low water-absorption, heat resistance, flame retardance, and mechanical properties; laminates NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-06-07 US disclosed
EP-1746116-A1 COPOLYMER, GRAFT COPOLYMER, GRAFT COPOLYMER PARTICLE, FLAME RETARDANT, AND RESIN COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
US-20060177666-A1 Curable resin compositions NIPPON STEEL CHEMICAL CO., LTD. (JP) 2006-08-10 US disclosed
EP-1201303-A1 CATIONIC EXCHANGE RESIN Nippon Steel Chemical Co., Ltd. (JP) 2002-05-02 EP disclosed
JP-H09151140-A DIVINYLBIPHENYL COMPOSITION NIPPON STEEL CHEM CO LTD 1997-06-10 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260047004-A1 METHOD FOR PRODUCING METAL FOIL-CLAD LAMINATE, RESIN COMPOSITION, RESIN COMPOSITE SHEET, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE SEM1, RIOK1, CBLB BACE1 3436/4885CYP2A6 4260/4885GRIN2D 512/4885
US-20260078240-A1 HOLLOW PARTICLES, RESIN COMPOSITION AND MOLDED BODY ARID2, BRWD1, WDR1 BACE1 3069/4885CYP2A6 3652/4885GRIN2D 555/4885
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION VMA21, ARCN1, RAD51 BACE1 765/4885CYP2A6 3760/4885GRIN2D 695/4885
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME ARCN1, TGFBR1, C1R BACE1 706/4885CYP2A6 2714/4885GRIN2D 806/4885
US-20260138110-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY SEM1, DAP3, HAO2 BACE1 4555/4885CYP2A6 1715/4885GRIN2D 789/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.