SCHEMBL10277639

SCHEMBL10277639

CO[Si](OC)(OC)C1=Cc2ccccc2C1

nearest known ligand 0.45

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
PTGS2 P35354 3/20 0.45
CYP11B2 P19099 3/20 0.40
CYP11B1 P15538 2/20 0.38
TRPA1 O75762 5/20 0.36
MAOA P21397 1/20 0.36
MAOB P27338 1/20 0.36
ACHE P22303 1/20 0.35
GPR84 Q9NQS5 1/20 0.34
MTNR1A P48039 1/20 0.33
MTNR1B P49286 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2743954 0.78 CYP11B2 (0.41) PTGS2CYP11B2CYP11B1TRPA1MAOA
SCHEMBL1452101 0.78 ACHE (0.41) PTGS2CYP11B2CYP11B1TRPA1MAOA
SCHEMBL15121440 0.78 CYP11B2 (0.41) PTGS2CYP11B2CYP11B1TRPA1MAOA
SCHEMBL8854215 0.76 ACHE (0.40) PTGS2CYP11B2CYP11B1TRPA1MAOA
SCHEMBL2235110 0.74 CYP11B2 (0.39) PTGS2CYP11B2CYP11B1TRPA1MAOA
Hydrochloric Acid SCHEMBL6761120 0.74 ACHE (0.39) PTGS2CYP11B2CYP11B1TRPA1MAOA
Hydrochloric Acid SCHEMBL8319505 0.74 CYP11B2 (0.42) PTGS2CYP11B2CYP11B1TRPA1MAOA
Hydrochloric Acid SCHEMBL6761124 0.74 CYP11B2 (0.42) PTGS2CYP11B2CYP11B1TRPA1MAOA
Hydrochloric Acid SCHEMBL8319503 0.74 CYP11B2 (0.39) PTGS2CYP11B2CYP11B1TRPA1MAOA
SCHEMBL5083961 0.72 PTGS2 (0.51) PTGS2CYP11B2CYP11B1ACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025022873-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND FINGERPRINT AUTHENTICATION DEVICE USING SAID CURED FILM 東レ株式会社 2025-01-30 WO disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
US-11650499-B2 Photosensitive resin composition, organic EL element barrier rib, and organic EL element SHOWA DENKO K.K. (JP) 2023-05-16 US disclosed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
WO-2023054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, MICROLENS 東レ株式会社 2023-04-06 WO disclosed
CN-115877663-A Photosensitive resin composition and method for manufacturing display device using same 三星显示有限公司 2023-03-31 CN disclosed
US-20230096077-A1 PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURING METHOD OF DISPLAY DEVICE USING THE SAME LTC CO., LTD (KR) 2023-03-30 US disclosed
US-11599023-B2 Photosensitive resin composition, organic EL element barrier rib, and organic EL element SHOWA DENKO K.K. (JP) 2023-03-07 US disclosed
EP-3369780-B1 METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT USING SAME TORAY INDUSTRIES (JP) 2022-10-26 EP disclosed
US-20220275241-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL SHOWA DENKO K.K. (JP) 2022-09-01 US disclosed
CN-105359037-A Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same TORAY INDUSTRIES 2016-02-24 CN disclosed
CN-102667625-B Positive type photosensitive organic compound, the cured film formed by said composition and there is the element of cured film TORAY INDUSTRIES, INC. (JP) 2015-11-25 CN disclosed
CN-104487516-A Polysiloxane composition, electrical device, and optical device TORAY INDUSTRIES 2015-04-01 CN disclosed
US-8828642-B2 Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES, INC. (JP) 2014-09-09 US disclosed
CN-102472964-B Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES 2013-08-07 CN disclosed
US-20120237873-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM TORAY INDUSTRIES INC. (JP) 2012-09-20 US disclosed
CN-102667625-A Positive photosensitive resin composition, cured film formed from the same, and device having cured film TORAY INDUSTRIES 2012-09-12 CN disclosed
EP-2485091-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE Toray Industries, Inc. (JP) 2012-08-08 EP disclosed
US-20120178022-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED USING SAME, AND OPTICAL DEVICE TORAY INDUSTRIES, INC. (JP) 2012-07-12 US disclosed
CN-102472964-A Positive photosensitive resin composition, cured film obtained using same, and optical device TORAY INDUSTRIES 2012-05-23 CN disclosed