SCHEMBL10337273

SCHEMBL10337273

Cc1ccc(OCl)cc1O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.46
CASP1 P29466 1/20 0.46
ACHE P22303 2/20 0.43
TRPA1 O75762 1/20 0.43
PTGS1 P23219 1/20 0.43
CACNA1C Q13936 1/20 0.43
CYP3A4 P08684 4/20 0.41
ALDH1A1 P00352 3/20 0.41
ALOX15 P16050 2/20 0.41
HPGD P15428 2/20 0.41
MAPK1 P28482 2/20 0.41
KDM4E B2RXH2 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2D6 P10635 1/20 0.41
MAPT P10636 1/20 0.41
G6PD P11413 1/20 0.41
CYP2C9 P11712 1/20 0.41
PKM P14618 1/20 0.41
ALOX12 P18054 1/20 0.41
CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL78097 0.81 TSHR (0.50) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL929945 0.79 CYP3A4 (0.56) TSHRCASP1PTGS1CYP3A4ALDH1A1
SCHEMBL8486745 0.76 KMT2A (0.51) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL14660398 0.76 TSHR (0.45) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL923019 0.74 TP53 (0.46) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL4237202 0.74 TRPA1 (0.50) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL28074392 0.74 TSHR (0.43) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL14925306 0.74 TRIM24 (0.44) TSHRCASP1ACHETRPA1PTGS1
SCHEMBL4229019 0.74 LTA4H (0.53) TSHRCASP1CYP3A4ALDH1A1ALOX15
SCHEMBL14707162 0.74 MEN1 (0.47) TSHRCASP1ACHETRPA1PTGS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0387554-A2 Liquid epoxy polymer composition and use thereof International Business Machines Corporation (US) 1990-09-19 EP disclosed
EP-0375980-A2 Epoxy composition of increased thermal conductivity and use thereof International Business Machines Corporation (US) 1990-07-04 EP disclosed