SCHEMBL10339013

SCHEMBL10339013

O=C(/C=C\C(=O)OC(CN1C(=O)C=CC1=O)N1C(=O)C=CC1=O)OC(CN1C(=O)C=CC1=O)N1C(=O)C=CC1=O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GSK3A P49840 1/20 0.38
GSK3B P49841 1/20 0.38
ALDH1A1 P00352 3/20 0.35
BLM P54132 2/20 0.35
HPGD P15428 2/20 0.35
CYP1A2 P05177 1/20 0.35
CYP2C19 P33261 1/20 0.35
WRN Q14191 1/20 0.35
HIF1A Q16665 1/20 0.35
MGLL Q99685 4/20 0.32
LMNA P02545 2/20 0.31
MAPT P10636 2/20 0.31
NPSR1 Q6W5P4 2/20 0.31
FAAH O00519 2/20 0.31
GMNN O75496 1/20 0.31
THPO P40225 1/20 0.31
PMP22 Q01453 1/20 0.31
PTGS1 P23219 5/20 0.31
PTGS2 P35354 5/20 0.31
HSP90AA1 P07900 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28787286 0.72 MGLL (0.45) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL29250837 0.68 MGLL (0.36) ALDH1A1BLMHPGDMGLLLMNA
SCHEMBL44138 0.67 MGLL (0.46) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL28033818 0.67 THRB (0.36) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL12930410 0.66 MGLL (0.50) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL28984327 0.66 ALDH1A1 (0.38) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL19971742 0.65 MGLL (0.44) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL17301050 0.64 PTGS1 (0.46) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL23339728 0.63 KMT2A (0.35) GSK3AGSK3BALDH1A1BLMHPGD
SCHEMBL15394140 0.63 BLM (0.42) GSK3AGSK3BALDH1A1BLMHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2140225-A None JP disclosed
JP-H02140225-A EPOXY RESIN MOLDING MATERIAL COMPOSITION MATSUSHITA ELECTRIC WORKS LTD 1990-05-29 JP disclosed