Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.38 |
| ▸ | NCOA1 | Q15788 | 2/20 | 0.38 |
| ▸ | NCOA3 | Q9Y6Q9 | 2/20 | 0.38 |
| ▸ | TAAR1 | Q96RJ0 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | KIT | P10721 | 2/20 | 0.35 |
| ▸ | KDR | P35968 | 2/20 | 0.35 |
| ▸ | FLT3 | P36888 | 2/20 | 0.35 |
| ▸ | ACHE | P22303 | 2/20 | 0.34 |
| ▸ | BCHE | P06276 | 1/20 | 0.34 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.34 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
| ▸ | PRKCZ | Q05513 | 1/20 | 0.33 |
| ▸ | HTR2A | P28223 | 1/20 | 0.33 |
| ▸ | KDM1A | O60341 | 1/20 | 0.33 |
| ▸ | APP | P05067 | 2/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27777789 | 0.95 | CYP3A4 (0.41) | HSD17B10CYP3A4TDP1NCOA1NCOA3 | |
| SCHEMBL573085 | 0.85 | KMT2A (0.47) | CHRNB2CHRNA4KDM1A | |
| SCHEMBL8984742 | 0.85 | MEN1 (0.47) | ALDH1A1CHRNB2CHRNA4HTR2AL3MBTL1 | |
| SCHEMBL1289717 | 0.85 | CHRNB2 (0.33) | HSD17B10ALDH1A1CHRNB2CHRNA4HTR2A | |
| SCHEMBL30287378 | 0.84 | CHRNB2 (0.44) | HSD17B10CYP3A4NCOA1NCOA3ALDH1A1 | |
| SCHEMBL150218 | 0.84 | CHRNB2 (0.44) | HSD17B10CYP3A4NCOA1NCOA3ALDH1A1 | |
| SCHEMBL19566504 | 0.83 | HSD17B10 (0.50) | HSD17B10CYP3A4TDP1NCOA1NCOA3 | |
| SCHEMBL27840599 | 0.82 | ALDH1A1 (0.36) | HSD17B10CYP3A4TDP1NCOA1NCOA3 | |
| SCHEMBL1681655 | 0.81 | HTR2A (0.43) | HSD17B10CYP3A4TDP1NCOA1NCOA3 | |
| SCHEMBL4385697 | 0.81 | NPC1 (0.51) | CYP3A4ALDH1A1TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2276808-A1 | IMPROVED MOULDING PROCESSES | Hexcel Composites, Ltd. (GB) | 2011-01-26 | — | — | EP | claimed |
| EP-1553134-B1 | Polyimide compositions having resistance to water sorption, and methods relating thereto | DU PONT (US) | 2009-12-23 | — | — | EP | claimed |
| WO-2009138749-A1 | IMPROVED MOULDING PROCESSES | HEXCEL COMPOSITES LIMITED (GB) | 2009-11-19 | — | — | WO | claimed |
| US-12344719-B2 | Polyester film and foldable display device comprising the same | SK MICROWORKS CO., LTD. (KR) | 2025-07-01 | — | — | US | disclosed |
| WO-2023243676-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-12-21 | — | — | WO | disclosed |
| US-20230407022-A1 | POLYESTER FILM AND FOLDABLE DISPLAY DEVICE COMPRISING THE SAME | MICROWORKS CO. LTD. (KR) | 2023-12-21 | — | — | US | disclosed |
| WO-2023153445-A1 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER | 株式会社レゾナック | 2023-08-17 | — | — | WO | disclosed |
| WO-2023152838-A1 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER | 株式会社レゾナック | 2023-08-17 | — | — | WO | disclosed |
| WO-2023074886-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074909-A1 | POLYIMIDE POROUS FILM, ELECTRODE STRUCTURE, AND POWER STORAGE DEVICE | 株式会社スリーダムアライアンス | 2023-05-04 | — | — | WO | disclosed |
| WO-2023048265-A1 | POLISHING PAD | 株式会社クラレ | 2023-03-30 | — | — | WO | disclosed |
| EP-0310320-B1 | Curable composition | JAPAN SYNTHETIC RUBBER CO LTD (JP) | 1994-12-28 | — | — | EP | disclosed |
| EP-0480288-B1 | Ultrathin heat-stable bismaleinimide films and method of making them | BASF AG (DE) | 1994-07-27 | — | — | EP | disclosed |
| US-5246784-A | ULTRATHIN THERMOSTABLE BISMALEIMIDE FILMS AND PRODUCTION THEREOF | BASF AKTIENGESELLSCHAFT (DE) | 1993-09-21 | — | — | US | disclosed |
| EP-0480288-A2 | Ultrathin heat-stable bismaleinimide films and method of making them | BASF Aktiengesellschaft (DE) | 1992-04-15 | — | — | EP | disclosed |
| EP-0387381-A1 | Process for producing unsaturated dicarboxylic acid imide compound | MATSUSHITA ELECTRIC WORKS, LTD. (JP) | 1990-09-19 | — | — | EP | disclosed |
| US-4923948-A | Curable composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1990-05-08 | — | — | US | disclosed |
| EP-0310320-A2 | Curable composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1989-04-05 | — | — | EP | disclosed |
| US-4794159-A | Heat-resistant polyamide from bis(4-aminophenyl)fluorene | NIPPON STEEL CORPORATION (JP) | 1988-12-27 | — | — | US | disclosed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | disclosed |