SCHEMBL10437486

SCHEMBL10437486

CCC(=O)/C=N/OC(=O)c1ccccc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLA2G7 Q13093 6/20 0.57
MIF P14174 1/20 0.51
LMNA P02545 2/20 0.47
TSHR P16473 2/20 0.46
F2 P00734 1/20 0.44
CES2 O00748 1/20 0.43
CES1 P23141 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.42
CDK5 Q00535 2/20 0.42
CDK5R1 Q15078 2/20 0.42
MAPT P10636 1/20 0.42
PKM P14618 1/20 0.42
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42
TDP1 Q9NUW8 2/20 0.42
MAPK1 P28482 2/20 0.41
KMT2A Q03164 2/20 0.41
TNF P01375 1/20 0.41
KLF5 Q13887 1/20 0.41
NOD1 Q9Y239 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10437490 1.00 PLA2G7 (0.57) PLA2G7MIFLMNATSHRF2
SCHEMBL27783160 0.84 CES2 (0.50) PLA2G7MIFLMNACES2CES1
SCHEMBL14616995 0.81 PLA2G7 (0.59) PLA2G7MIFLMNATSHRF2
SCHEMBL2532511 0.78 PLA2G7 (0.65) PLA2G7MIFLMNATSHRF2
SCHEMBL2890648 0.78 PLA2G7 (0.65) PLA2G7MIFLMNATSHRF2
SCHEMBL10437488 0.76 PLA2G7 (0.57) PLA2G7MIFLMNATSHRF2
SCHEMBL734681 0.76 PLA2G7 (0.67) PLA2G7MIFLMNATSHRF2
SCHEMBL734682 0.76 PLA2G7 (0.67) PLA2G7MIFLMNATSHRF2
SCHEMBL9070381 0.75 PLA2G7 (0.61) PLA2G7MIFLMNATSHRF2
SCHEMBL10406729 0.74 PLA2G7 (0.65) PLA2G7MIFLMNATSHRF2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0377321-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1990-07-11 EP claimed
US-9494866-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-11-15 US disclosed
US-9411224-B2 Method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-08-09 US disclosed
US-9411224-B2 Method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-08-09 US disclosed
US-9405200-B2 Resist composition and method of forming resist pattern TOYKO OHKA KOGYO CO., LTD. (JP) 2016-08-02 US disclosed
US-9405200-B2 Resist composition and method of forming resist pattern TOYKO OHKA KOGYO CO., LTD. (JP) 2016-08-02 US disclosed
US-9377685-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-06-28 US disclosed
US-9377685-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-06-28 US disclosed
US-20150147702-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2015-05-28 US disclosed
US-20150147702-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2015-05-28 US disclosed
US-20130137047-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-30 US disclosed
US-20130115555-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-09 US disclosed
US-20130115555-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-09 US disclosed
US-20130084523-A1 RESIST COMPOSITIOIN AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-04-04 US disclosed
US-20130084523-A1 RESIST COMPOSITIOIN AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-04-04 US disclosed
US-20130078572-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-28 US disclosed
US-20130078572-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-28 US disclosed
US-20130017500-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-01-17 US disclosed
US-20130017500-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-01-17 US disclosed
EP-0377321-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1990-07-11 EP disclosed