Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.55 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.45 |
| ▸ | TSHR | P16473 | 5/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.43 |
| ▸ | TP53 | P04637 | 2/20 | 0.43 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.43 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.40 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.40 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.40 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.40 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.40 |
| ▸ | NPC1 | O15118 | 3/20 | 0.40 |
| ▸ | RAB9A | P51151 | 3/20 | 0.40 |
| ▸ | LMNA | P02545 | 2/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | BCAT2 | O15382 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24709495 | 0.88 | THRB (0.60) | THRBTSHRALDH1A1TP53HIF1A | |
| SCHEMBL1685743 | 0.83 | THRB (0.50) | THRBRIPK1TSHRALDH1A1CYP2C19 | |
| SCHEMBL5070208 | 0.83 | THRB (0.54) | THRBRIPK1TSHRALDH1A1TP53 | |
| SCHEMBL28054252 | 0.83 | THRB (0.54) | THRBTSHRALDH1A1TP53HIF1A | |
| SCHEMBL27382463 | 0.81 | RIPK1 (0.47) | RIPK1CHRNB2CHRNB4CHRNA3CHRNA4 | |
| SCHEMBL15901529 | 0.81 | THRB (0.55) | THRBTSHRALDH1A1TP53HIF1A | |
| SCHEMBL28043245 | 0.80 | THRB (0.51) | THRBTSHRALDH1A1TP53HIF1A | |
| SCHEMBL1649360 | 0.80 | RIPK1 (0.46) | RIPK1CHRNB2CHRNB4CHRNA3CHRNA4 | |
| SCHEMBL11693593 | 0.79 | THRB (0.50) | THRBTSHRALDH1A1TP53HIF1A | |
| SCHEMBL21837192 | 0.79 | CHRNB2 (0.68) | THRBTSHRALDH1A1TP53HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250188322-A1 | Curable adhesive substance with improved punchability | TESA SE (DE) | 2025-06-12 | — | — | US | disclosed |
| US-11942353-B2 | Adhesive tape for semiconductor processing and method for producing semiconductor device | LINTEC CORPORATION (JP) | 2024-03-26 | — | — | US | disclosed |
| WO-2024058094-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2024-03-21 | — | — | WO | disclosed |
| US-11842916-B2 | Semiconductor processing adhesive tape and method of manufacturing semiconductor device | LINTEC CORPORATION (JP) | 2023-12-12 | — | — | US | disclosed |
| WO-2023054318-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-04-06 | — | — | WO | disclosed |
| WO-2023281860-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023281858-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023281859-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023281861-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-112334558-B | Adhesive tape for semiconductor processing and method for manufacturing semiconductor device | 琳得科株式会社 | 2022-12-06 | — | — | CN | disclosed |
| US-7361971-B2 | Semiconductor wafer protection structure and laminated protective sheet for use therein | LINTEC CORPORATION (JP) | 2008-04-22 | — | — | US | disclosed |
| US-20060043532-A1 | Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer | LINTEC CORPORATION (JP) | 2006-03-02 | — | — | US | disclosed |
| EP-1542274-A1 | PROTECTIVE STRUCTURE OF SEMICONDUCTOR WAFER, METHOD FOR PROTECTING SEMICONDUCTOR WAFER, MULTILAYER PROTECTIVE SHEET USED THEREIN, AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER | Lintec Corporation (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-6878441-B2 | Pressure sensitive adhesive sheet | LINTEC CORPORATION (JP) | 2005-04-12 | — | — | US | disclosed |
| EP-1002845-B1 | Pressure sensitive adhesive sheet and method of use thereof | LINTEC CORP (JP) | 2005-03-02 | — | — | EP | disclosed |
| EP-0999250-B1 | Pressure sensitive adhesive sheet for use in semiconductor wafer working | LINTEC CORP (JP) | 2004-03-31 | — | — | EP | disclosed |
| US-20030104199-A1 | Pressure sensitive adhesive sheet | LINTEC CORPORATION | 2003-06-05 | — | — | US | disclosed |
| US-6524701-B1 | A substrate with an intermediate layer superimposed on it and a pressure sensitive adhesive layer superimposed on the intermediate layer | LINTEC CORPORATION (JP) | 2003-02-25 | — | — | US | disclosed |
| EP-1002845-A2 | Pressure sensitive adhesive sheet and method of use thereof | Lintec Corporation (JP) | 2000-05-24 | — | — | EP | disclosed |
| EP-0999250-A2 | Pressure sensitive adhesive sheet for use in semiconductor wafer working | Lintec Corporation (JP) | 2000-05-10 | — | — | EP | disclosed |