SCHEMBL106032

SCHEMBL106032

CCCCOCC(=O)C(CC)(CC)C(=O)[O-].CCCCOCC(=O)C(CC)(CC)C(=O)[O-].CCCCOCC(=O)C(CC)(CC)C(=O)[O-].[Al+3]

nearest known ligand 0.50

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CES2 O00748 3/20 0.50
TSHR P16473 2/20 0.35
ALDH1A1 P00352 1/20 0.34
FAAH O00519 5/20 0.32
ATM Q13315 1/20 0.32
PLA2G4B P0C869 2/20 0.32
CES1 P23141 3/20 0.32
CYP3A4 P08684 1/20 0.32
MEN1 O00255 1/20 0.32
CYP1A2 P05177 1/20 0.32
KMT2A Q03164 1/20 0.32
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL105815 0.97 CES2 (0.50) CES2TSHRALDH1A1FAAHATM
SCHEMBL6324617 0.97 CES2 (0.50) CES2TSHRALDH1A1FAAHATM
SCHEMBL105781 0.97 CES2 (0.50) CES2TSHRALDH1A1FAAHATM
SCHEMBL109457 0.89 CES2 (0.41) CES2
SCHEMBL108937 0.86 CES2 (0.41) CES2
SCHEMBL107315 0.86 CES2 (0.41) CES2
SCHEMBL28412886 0.82 CES2 (0.53) CES2TSHRALDH1A1FAAHATM
SCHEMBL105816 0.81 CES2 (0.51) CES2TSHRALDH1A1FAAHATM
SCHEMBL106033 0.81 CES2 (0.51) CES2TSHRALDH1A1FAAHATM
SCHEMBL105782 0.81 CES2 (0.51) CES2TSHRALDH1A1FAAHATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 116 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4700067-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPERSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-25 EP disclosed
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-12 US disclosed
EP-4692941-A2 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20260029706-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPER STRAIGHT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-29 US disclosed
US-12521919-B2 Anisotropic film and method for manufacturing anisotropic film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-13 US disclosed
CN-112526822-B Composition for forming silicon-containing resist underlayer film and pattern forming method 信越化学工业株式会社 2025-02-28 CN disclosed
CN-112286000-B Composition for forming silicon-containing resist underlayer film and pattern forming method 信越化学工业株式会社 2024-12-03 CN disclosed
EP-4428200-A1 CROSSLINKABLE RESIN COMPOSITION AND CURED ARTICLE DIC Corporation (JP) 2024-09-11 EP disclosed
CN-118620392-A Composition for forming silicon-containing resist underlayer film and pattern forming method 信越化学工业株式会社 2024-09-10 CN disclosed
US-20240286321-A1 ANISOTROPIC FILM AND METHOD FOR MANUFACTURING ANISOTROPIC FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-29 US disclosed
US-20100147334-A1 Coated-type silicon-containing film stripping process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-17 US disclosed
EP-2196858-A1 Coated-type silicon-containing film stripping process Shin-Etsu Chemical Co., Ltd. (JP) 2010-06-16 EP disclosed
US-20100086872-A1 Metal oxide-containing film-forming composition, metal oxide-containing film-formed substrate, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-04-08 US disclosed
EP-2172808-A1 Metal oxide-containing film-forming composition metal oxide-containing film-formed substrate, and patterning process Shinetsu Chemical Co., Ltd. (JP) 2010-04-07 EP disclosed
US-20090286188-A1 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-19 US disclosed
EP-1876201-B1 Use of a resin composition for sealing an LED element SHINETSU CHEMICAL CO (JP) 2009-08-26 EP disclosed
US-20090136869-A1 METAL OXIDE-CONTAINING FILM-FORMING COMPOSITION, METAL OXIDE-CONTAINING FILM, METAL OXIDE-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-05-28 US disclosed
EP-2063319-A1 Metal oxide-containing film-forming composition, metal oxide-containing film, metal oxide-containing film-bearing substrate, and patterning method Shin-Etsu Chemical Co., Ltd. (JP) 2009-05-27 EP disclosed
US-20080008867-A1 RESIN COMPOSITION FOR SEALING OPTICAL DEVICE AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-01-10 US disclosed
EP-1876201-A1 Resin composition for sealing optical device and cured product thereof Shin-Etsu Chemical Co., Ltd. (JP) 2008-01-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260029706-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPER STRAIGHT SMC2, F12, SMC1A CES2 515/4885TSHR 3510/4885ALDH1A1 1644/4885
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SMC1A, SPOUT1, LBR CES2 2647/4885TSHR 446/4885ALDH1A1 1558/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.