SCHEMBL1063249

SCHEMBL1063249

C=CC(=O)OCCC[Si](OCCC)(OCCC)c1ccccc1

nearest known ligand 0.49

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.49
HPGD P15428 1/20 0.49
THRB P10828 5/20 0.46
ALDH1A1 P00352 5/20 0.41
CYP3A4 P08684 2/20 0.41
LMNA P02545 3/20 0.37
THRA P10827 1/20 0.37
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
TDP1 Q9NUW8 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
TP53 P04637 3/20 0.35
MAPK1 P28482 1/20 0.35
HIF1A Q16665 2/20 0.35
HSD17B10 Q99714 1/20 0.35
ATM Q13315 1/20 0.34
HCAR2 Q8TDS4 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7873872 0.96 TSHR (0.48) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL27424756 0.94 TSHR (0.49) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL1066699 0.92 THRB (0.48) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL1067387 0.91 THRB (0.47) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL27323436 0.87 TSHR (0.42) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL7803052 0.87 THRB (0.46) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL27449214 0.86 THRB (0.46) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL27806783 0.86 TSHR (0.46) TSHRHPGDTHRBALDH1A1CYP3A4
SCHEMBL9402872 0.86 ATM (0.40) TSHRCYP3A4LMNANPC1RAB9A
SCHEMBL21066707 0.86 TSHR (0.47) TSHRHPGDTHRBALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109476964-B Polymeric binder layer as a ceramic precursor 3M创新有限公司 2022-04-26 CN disclosed
US-20220119692-A1 DUST SUPPRESSION COMPOSITIONS AND METHODS 3M INNOVATIVE PROPERTIES CO (US) 2022-04-21 US disclosed
US-11292940-B2 Polymeric adhesive layers as ceramic precursors 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-04-05 US disclosed
US-11285702-B2 Siloxane-based adhesive layers as ceramic precursors 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-03-29 US disclosed
CN-109642143-B Siloxane-based adhesive layer as a ceramic precursor 3M创新有限公司 2021-09-24 CN disclosed
US-10947396-B2 Curable antifouling composition, method of use, and articles 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-03-16 US disclosed
US-20190352542-A1 POLYMERIC ADHESIVE LAYERS AS CERAMIC PRECURSORS 3M INNOVATIVE PROPERTIES COMPANY 2019-11-21 US disclosed
US-20190300634-A1 DUST SUPPRESSION COMPOSITIONS AND METHODS 3M INNOVATIVE PROPERTIES COMPANY 2019-10-03 US disclosed
US-20190218425-A1 SILOXANE-BASED ADHESIVE LAYERS AS CERAMIC PRECURSORS 3M INNOVATIVE PROPERTIES COMPANY 2019-07-18 US disclosed
US-20160312040-A1 Curable Antifouling Composition, Method of Use, and Articles 3M INNOVATIVE PROPERTIES COMPANY 2016-10-27 US disclosed
CN-102746467-B Curable composition and process for production of organosilicon compound TOAGOSEI CO LTD 2015-01-14 CN disclosed
US-8829142-B2 Curable composition and process for production of organosilicon compound TOAGOSEI CO., LTD. (JP) 2014-09-09 US disclosed
EP-2270070-B1 CURABLE COMPOSITION, AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND TOAGOSEI CO LTD (JP) 2014-07-30 EP disclosed
WO-2014078195-A1 CURABLE ANTIFOULING COMPOSITION, METHOD OF USE, AND ARTICLES 3M INNOVATIVE PROPERTIES COMPANY (US) 2014-05-22 WO disclosed
EP-2565217-B1 Curable composition and process for production of organosilicon compound TOAGOSEI CO LTD (JP) 2014-05-14 EP disclosed
EP-2370536-B1 COATING COMPOSITION 3M INNOVATIVE PROPERTIES CO (US) 2013-11-06 EP disclosed
US-20130149455-A1 CURABLE COMPOSITION AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND TOAGOSEI CO., LTD. (JP) 2013-06-13 US disclosed
EP-2565217-A1 Curable composition and process for production of organosilicon compound TOAGOSEI CO., LTD. (JP) 2013-03-06 EP disclosed
US-20110071255-A1 CURABLE COMPOSITION AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND TOAGOSEI CO., LTD. (JP) 2011-03-24 US disclosed
EP-2270070-A1 CURABLE COMPOSITION, AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND Toagosei Co., Ltd (JP) 2011-01-05 EP disclosed