SCHEMBL1068960

SCHEMBL1068960

C=C(OC1=CCC(C(=O)O)(C(=O)O)C=C1)Oc1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.33
RAB9A P51151 1/20 0.33
TDP1 Q9NUW8 2/20 0.32
KDM4E B2RXH2 2/20 0.32
MAPT P10636 2/20 0.32
ATM Q13315 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
MGLL Q99685 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
CYP19A1 P11511 1/20 0.31
HPGD P15428 1/20 0.30
ALOX15 P16050 1/20 0.30
HSD17B10 Q99714 1/20 0.30
USP2 O75604 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP3A4 P08684 1/20 0.30
NFKB1 P19838 1/20 0.30
NFKB2 Q00653 1/20 0.30
RELA Q04206 1/20 0.30
BCHE P06276 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL332453 0.81 PARP10 (0.35) RAB9AMAPTSMN1; SMN2HPGD
SCHEMBL1856126 0.75 MTNR1A (0.35) ALDH1A1RAB9ATDP1ATML3MBTL1
SCHEMBL9860315 0.73 AKR1C1 (0.30)
SCHEMBL9742025 0.72 L3MBTL1 (0.42) KDM4EMAPTATML3MBTL1
SCHEMBL1069023 0.69 LTA4H (0.45) ALDH1A1TDP1KDM4EMAPTATM
Hydrochloric Acid SCHEMBL8006256 0.65 THRB (0.32) TDP1
SCHEMBL28256376 0.65 THRB (0.32) TDP1
SCHEMBL11881216 0.65 KCNA3 (0.39) ALDH1A1RAB9ATDP1KDM4EMAPT
Biphenyl SCHEMBL9775373 0.64 TP53 (0.33) TDP1MAPTMGLLSMN1; SMN2HPGD
Water SCHEMBL28074687 0.64 THRB (0.31) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7863758-B2 Polyester-based thermoplastic resin, elastomer resin, epoxy resin, phenol curing agent, latent catalytic curing agent or curing catalyst, silane coupling agent, a filler; solid at room temperature, exhibits flowability at temperatures used during bonding of a die CHEIL INDUSTRIES, INC. (KR) 2011-01-04 US disclosed
US-20080145668-A1 Polyester-based thermoplastic resin, elastomer resin, epoxy resin, phenol curing agent, latent catalytic curing agent or curing catalyst, silane coupling agent, a filler; solid at room temperature, exhibits flowability at temperatures used during bonding of a die CHEIL INDUSTRIES, INC. (KR) 2008-06-19 US disclosed